Infineon Announced AIROC CYW20829 Bluetooth LE SoC Ready with Latest Bluetooth 5.4 Specification
Infineon Technologies AG has announced its AIROC™ CYW20829 Bluetooth® LE system on chip (SoC) is ready with the newly released...
Infineon Technologies AG has announced its AIROC™ CYW20829 Bluetooth® LE system on chip (SoC) is ready with the newly released...
Renesas Electronics Corporation announced a new industrial microprocessor (MPU) that supports the EtherCAT communication protocol, achieving high-speed, accurate real-time control...
Rohde & Schwarz demonstrates the new R&S EPL1000 EMI test receiver for reliable certification measurements with minimum test times at...
Analog Devices has introduced a super low noise dual output DC/DC μModule regulator with patented silicon, layout, and packaging innovations....
proteanTecs has announced today a collaboration with BAE Systems to enable a zero trust supply chain for defense and critical...
Lexar has announced the launch of the world’s fastest Lexar® Professional CFexpress™ Type A Card GOLD series in the Indian...
Omron Electronic Components Europe has further expanded its MOSFET relay G3VM series line-up now offering increased sensitivity and higher dielectric...
Keysight Technologies has expanded its electric vehicle (EV) and electric vehicle supply equipment (EVSE) charging test portfolio to create an...
The concept of automated policing began as a science fiction concept years ago, but today it is real and impactful....
Nordic design partner HooRii Technology has launched a Matter, Lightweight Machine-to-Machine (LwM2M) and Open Connectivity Foundation (OCF) over Thread compatible module, designed...
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