Semiconductor

LYON, France - The global power electronics industry is entering a new phase. After years of rapid expansion fueled by...

Gmunden– ‘step-shape’ DIN rail concept for space-constrained flat-panel distribution boards. Following the November launch of RECOM’s 90W step-shape module in...

Offered in the PowerPAK®  SO-8 Single Package, Devices Provide High Vth(min) > 2.5 V and Qgd / Qgs Ratios < 1 MALVERN, Pa. — Vishay Intertechnology, Inc....

Singapore — GigaDevice has announced the launch of its new GD24CL series I²C EEPROM. The series delivers outstanding performance, comprehensive...

Panasonic Industry Europe’s PhotoMOS® mobile app is now available for Android devices. The app offers developers easy and valuable orientation...

Dresden- Infineon Technologies AG opened the Smart Power Fab in Dresden several months ahead of schedule. The new plant, with...

ATEK MIDAS a novel designer and leader in high performance mixed-signal silicon ASICs & RFICs and advanced GaAs & GaN MMICs...

STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, has introduced the ST54M, a secure mobile...

Key takeaways:  Panel-level packaging enables higher area efficiency and scalability for large-format advanced packages  Transitioning from wafer to panel introduces...

The DSA504RT delivers high-performance timing and integration at a cost-efficient price point National: Spacecraft timing systems must provide highly stable,...