News highlights: The industry’s first 26-cells-in-series channel battery monitor delivers best-in-class sensing accuracy, reducing system costs by supporting more cells...
Read moreROHM has developed the TSC3PAK (14.00 × 18.58 × 3.50mm) package for SiC MOSFETs. By adopting a top-side heat dissipation...
Read moreBangalore, India – As India accelerates towards electric mobility, CIYES Systems is inviting entrepreneurs, property owners, fleet operators, institutions, and...
Read moreDirect-cooled thermal management offered by a reflow-compatible, isolated thermal pad significantly improves power density, reliability, and efficiency. Integrated aluminum nitride...
Read moreMunich, Germany – Infineon Technologies AG introduces the EiceDRIVER™ 2EDL90xG3, a 120 V common footprint gate driver designed to enable...
Read moreMunich, Germany – Megatrends such as green mobility, robotics, and artificial intelligence are placing increasingly demanding requirements on power systems...
Read moreMunich, Germany – Infineon Technologies AG introduces three new variants of the CoolSET™ System-in-Package (SiP), the ICE188LM, ICE189LM, and ICE180LM,...
Read moreMunich, Germany – Infineon Technologies AG has introduced a new family of reinforced isolated gate-driver ICs for battery electric vehicle...
Read moreLake Forest, CA – SemiQ Inc, a designer, developer, and global supplier of superior silicon carbide (SiC) solutions for ultra-efficient, high-performance,...
Read moreTORRANCE, CA – Navitas Semiconductor, an industry leader in next-generation GaNFast™ gallium nitride (GaN) and GeneSiC™ silicon carbide (SiC) power...
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