News

Cutting both on-resistance and switching loss, while optimizing body-diode properties, the STMicroelectronics 40V MOSFETs, STL320N4LF8 and STL325N4LF8AG, save energy and ensure low noise...

Huawei Technologies has entered into a patent license agreement with Nordic Semiconductor. The agreement grants a fair, reasonable and non-discriminatory...

TOKYO- Sony Group Corporation ("Sony") and Honda Motor Co., Ltd. ("Honda") has announced that they have signed a joint venture agreement...

RECOM’s new RPX-0.5Q and RPX-1.5Q are qualified to AEC-Q100 Grade 1 requirements, opening up more options for automotive applications as...

TOKYO, Japan ― Renesas Electronics Corporation has announced that it has developed circuit technologies for an embedded spin-transfer torque magnetoresistive random-access...

Nijmegen- Nexperia has announced two Electrostatic Discharge (ESD) protection devices optimized for use with retimers and redrivers on high-speed data...

SIP or horizontal mount formatInput 6 – 15 VOutput 0.6 – 5 VParallelable up to four unitsPMBus® Flex Power Modules...

Munich, Germany – Infineon Technologies AG is adding the AIROC CYW20820 Bluetooth & Bluetooth LE (low energy) system on chip...

e-peas will be using this year’s Embedded World exhibition to showcase the breadth of applications empowered by its technology as well...

TOKYO- Lendlease and Princeton Digital Group (PDG) today marked the commencement of construction of a 100 MW data center campus...