TECH ROOM

Many modular low-power DC/DCs on the market have been designed to suit manual, low-cost assembly, which only suits the simplest...

Murata has introduced its latest engineering innovations at Embedded World 2023, Nuremberg. (14th - 16th March. Hall 4A Stand 4A-645)...

Leading electronics manufacturer Murata announces the introduction of the DLW32PH122XK2 wire wound chip common mode choke coil. AEC-Q200-qualified, this 1210...

Littelfuse announced the latest release of four versatile circuit protection devices in the eFuse Protection ICs product line. The latest eFuse...

Cetec ERP will exhibit at the SMTA Dallas Expo & Tech Forum on Tuesday, March 28, 2023, at the Plano...

Pemtron Technology is pleased to announce plans to exhibit at the SMTA Monterrey Expo & Tech Forum, scheduled to take...

iWave launches iW-RainboW-G50M: The Solderable NXP i.MX 93-based LGA System on Module (SoM). The SoM incorporates NXP’s  powerful i.MX 93...

Overview During the March "Patch Tuesday" security update, a new Outlook security vulnerability was revealed as being exploited in the...

DermaSensor Inc., a health technology company equipping primary care physicians (PCPs) with a non-invasive device for use in evaluation of...

Toshiba Electronic Devices & Storage Corporation will provide samples of " TB9032FNG ", a vehicle-mounted A driver/receiver integrated circuit (IC) for the physical...