Infineon Technologies AG has announced its AIROC™ CYW20829 Bluetooth® LE system on chip (SoC) is ready with the newly released...
Read moreRenesas Electronics Corporation announced a new industrial microprocessor (MPU) that supports the EtherCAT communication protocol, achieving high-speed, accurate real-time control...
Read moreAnalog Devices has introduced a super low noise dual output DC/DC μModule regulator with patented silicon, layout, and packaging innovations....
Read moreproteanTecs has announced today a collaboration with BAE Systems to enable a zero trust supply chain for defense and critical...
Read moreNordic design partner HooRii Technology has launched a Matter, Lightweight Machine-to-Machine (LwM2M) and Open Connectivity Foundation (OCF) over Thread compatible module, designed...
Read moreLeading electronics manufacturer Murata announces the introduction of the DLW32PH122XK2 wire wound chip common mode choke coil. AEC-Q200-qualified, this 1210...
Read moreLittelfuse announced the latest release of four versatile circuit protection devices in the eFuse Protection ICs product line. The latest eFuse...
Read moreToshiba Electronic Devices & Storage Corporation will provide samples of " TB9032FNG ", a vehicle-mounted A driver/receiver integrated circuit (IC) for the physical...
Read moreSTMicroelectronics’ STM32WBA52 microcontrollers (MCUs) combine Bluetooth® LE 5.3 connectivity with ultra-low-power modes, advanced security, and a broad selection of peripherals familiar to STM32...
Read moreEmbedded security continues to be a high priority, and architects need vetted, easy-to-use and cost-optimized security solutions that are compliant...
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