Semiconductor

Infineon Technologies AG has announced its AIROC™ CYW20829 Bluetooth® LE system on chip (SoC) is ready with the newly released...

Renesas Electronics Corporation announced a new industrial microprocessor (MPU) that supports the EtherCAT communication protocol, achieving high-speed, accurate real-time control...

Analog Devices has introduced a super low noise dual output DC/DC μModule regulator with patented silicon, layout, and packaging innovations....

proteanTecs has announced today a collaboration with BAE Systems to enable a zero trust supply chain for defense and critical...

Nordic design partner HooRii Technology has launched a Matter, Lightweight Machine-to-Machine (LwM2M) and Open Connectivity Foundation (OCF) over Thread compatible module, designed...

Leading electronics manufacturer Murata announces the introduction of the DLW32PH122XK2 wire wound chip common mode choke coil. AEC-Q200-qualified, this 1210...

Littelfuse announced the latest release of four versatile circuit protection devices in the eFuse Protection ICs product line. The latest eFuse...

Toshiba Electronic Devices & Storage Corporation will provide samples of " TB9032FNG ", a vehicle-mounted A driver/receiver integrated circuit (IC) for the physical...

STMicroelectronics’ STM32WBA52 microcontrollers (MCUs) combine Bluetooth® LE 5.3 connectivity with ultra-low-power modes, advanced security, and a broad selection of peripherals familiar to STM32...

Embedded security continues to be a high priority, and architects need vetted, easy-to-use and cost-optimized security solutions that are compliant...