NORTH BILLERICA, Mass.— BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, will highlight its TrueFlat™ reflow oven technology at SEMICON Taiwan in booth #M1039. The expo is scheduled to take place September 6-8, 2023 at TaiNEX 1 & 2 in Taipei.
“Very thin substrates represent a special challenge for thermal processing,” said Joe Yang, product manager at BTU. “Our TrueFlat technology ensures that even substrates as thin as 0.15 mm are kept flat throughout the entire reflow process.”
Part of the industry-leading Pyramax reflow oven platform, TrueFlat technology addresses the critical challenge of substrate warpage. One of the standout features of the TrueFlat is its exceptional thermal uniformity, made possible by integrating the Pyramax’s closed-loop convection heating system. By eliminating die tilt and accommodating substrate thicknesses ranging from 0.15-0.30 mm, TrueFlat technology maximizes process yield.
Easy to maintain with no vacuum pump, the system offers simple operation and full integration with BTU’s proprietary Wincon™ Windows-based software including factory host/MES interface for Industry 4.0 compliance. This innovative configuration enables manufacturers to achieve reliable and optimal results across a range of applications.
Visit BTU International’s booth at SEMICON Taiwan 2023. To learn more visit www.btu.com.
