Munich, Germany –Türkiye has issued nearly five million next-generation electronic passports with contactless Coil on Module (CoM CL) solution from Infineon Technologies AG. The passport includes a polycarbonate (PC) data page with an integrated security chip, which is embedded in a contactless module based on the reliable CoM technology. The data page contains sensitive personal data of the holder. Due to the security-critical nature of this information, official travel documents must be designed to highest security standards in order to provide reliable protection against tampering and fraud. Infineon’s contactless CoM solution not only increases the robustness of the ePassport, but also enables enhanced security.
“At Infineon, we are delighted to continue our role as a trusted partner to Türkiye by consistently integrating our security components into the new government identity eDocuments,” said Maurizio Skerlj, Vice President Authentication & Identity Solutions at Infineon’s Connected Secure Systems Division. “Enabled by embedded Infineon components, the new eDatapage is only 630 µm thick, making it one of the thinnest in the world. We are very proud of this attractive and reliable product that represents the next level of document security and design.”
Coil on Module technology for enhanced security and reliability
Innovative Coil on Module contactless packaging technology is designed for highly robust and flexible contactless government ID and passport documents. These travel documents require appropriate security and robustness over their lifetime, which is typically up to ten years. This packaging solution is based on inductive coupling technology, which uses a radio frequency link to wirelessly connect the module to the antenna embedded in the document, similar to the link between a card and a contactless card reader. This increases the robustness of an electronic data page.
In addition, Infineon’s FCOS™ (Flip Chip on Substrate) manufacturing technology enables the production of a module with a thickness of only 125 µm, which is up to 50 percent thinner than conventional contactless modules. This facilitates the production of ultra-thin antenna inlays of approximately 200 µm for passport eDatapages that are approximately 500 µm thick. The reduced thickness allows the issuing state printer to embed additional security layers in the ePassport’s PC eDatapage to meet highest security standards.
Türkiye’s population has grown to nearly 86 million people by 2023 and is still growing. As a result, the demand for fraud-resistant passports is growing. The highlight of the new Turkish ePassports: Enabled by embedded Infineon components its ultra-thin electronic PC data page measures only 630 µm in thickness, making it one of the thinnest in the world. This makes the new Turkish passport stand out from many other travel documents in circulation, not only because of its exquisite design, but also because of its robustness and security features that help prevent fraud. The Turkish ePassport will be presented at Infineon’s booth at TRUSTECH 2023.
More information about the Coil on Module contactless technology can be found here.
Infineon at TRUSTECH 2023
Visit Infineon at this year’s TRUSTECH from 28 through 30 November at Paris Expo Porte de Versailles, booth G035 in Pavilion 5.2. Dive into the Infineon mini airport booth where the company will unveil the world’s first PQC-enabled ePassport demonstrator as well as seamless biometric payment solutions with SECORA Pay Bio. In addition, the latest breakthroughs in innovative payment form factors will be showcased, including a pop-up manicure salon where visitors can be fitted with an artificial fingernail for contactless payment.
