Electronics Era

  • About Us
  • Advertise with Us
  • Contact Us
  • e-Mag
  • Webinars
Header logo on website
Advertisement
Advertisement
Menu
  • News
    • Industry News
    • Product News
  • TECH ROOM
    • Sensor
    • VR / AR
    • Embedded
    • Medical Electronics
    • Industry 4.0
    • Robotic
    • Automation
    • Smart Machine
    • Component
    • Manufacturing
    • Aerospace & Defence
    • Security
    • Policy
  • Semiconductor
    • AUTOMOTIVE ELECTRONICS
      • EVs
      • HEVs
      • ADAS
      • Connected Cars
    • IoT-Internet of Things
      • Development Kit
      • IoT Design
    • Power Electronics
      • AC-DC/DC-DC Converters
      • Mosfets
      • IGBTs
      • LEDs
  • T & M
    • 5G testing
    • Oscilloscopes
    • SDN & NFV
    • RF & Wireless
  • AI/ML
  • Telecom
    • 5G/6G
  • RENEWABLES
    • Sustainability
  • Future Tech
    • Data Center
    • Cloud Computing
    • Big Data Analytics
  • Webinars
  • Editor’s Pick
    • Tech Article
    • Tech Blog
    • White Papers
    • EE-Tech Talk
    • Market Research
  • EE Awards
    • EE Awards 2025
    • EE Awards 2024
  • MORE
    • E-Mag
    • Events
    • Subscription
    • Contact Us
Home News Product News

Take a New Approach to ESD Packaging for Electronics

Nimish by Nimish
August 1, 2024
in Product News, SMT/PCB/EMS
Reading Time: 3 mins read
EcoSonic ESD

EcoSonic ESD

Share on FacebookShare on TwitterShare on LinkedIn

In the world of electronics manufacturing, ESD managers have the critical role of ensuring that components do not get damaged by electrostatic discharge (ESD). Corrosion protection is often a lower priority but should also be on the radar for manufacturers who want their electronics to reach the end user in good condition. Fortunately, Cortec® has led the industry in designing two-in-one packaging solutions that meet both needs and today is eager to turn the spotlight on EcoSonic® ESD Paper as a sustainable alternative to standard plastic ESD bags.

Corrosion + ESD Protection

Shipping is a vulnerable time for electronics as they pass through a variety of climates and temperature fluctuations that could prompt condensation on subassemblies inside a package. Any corrosion or even staining will call the integrity of an electronic into question when the end user unwraps it. Cortec® therefore coats EcoSonic® ESD Paper with Vapor phase Corrosion Inhibitors (VCI/VpCI®) to protect multi-metals from oxidizing. VpCI® molecules in the coating vaporize and diffuse throughout a packaging enclosure, adsorb on metal surfaces, and form a protective molecular layer that does not need to be cleaned off when the module is installed. To address ESD concerns, EcoSonic® ESD Paper also has a static-dissipative coating to eliminate static electricity buildup. With this coating, the ESD properties of EcoSonic® ESD Paper meet the requirements of ANSI/ESD STM11.11 for surface resistance and MIL-STD 3010C Method 4046 for static decay rate. The final result is a two-in-one recyclable VCI/ESD paper.

Replacing Plastic Bags for Everyday Use

Even while Cortec® has been creating dual corrosion inhibiting / static-dissipative packaging for electronics, plastic bags have remained the main packaging format for a variety of reasons. EcoSonic® ESD Paper takes an important departure from this norm by replacing plastic with recyclable paper sourced from trees, a renewable resource. This answers the call for paper packaging options from electronics manufacturers in Europe and Asia. EcoSonic® ESD Paper can be easily applied by wrapping it around an electronic and taping the folds to hold them in place and create an enclosure. EcoSonic® ESD Paper can also be used to create an instant static-dissipative workspace by laying the paper on a work bench where employees assemble or inspect sensitive electronic parts.

Take a New Approach to Electronics Packaging

ESD managers and packaging engineers who need static dissipation should also consider whether a specific application needs corrosion protection. With EcoSonic® ESD Paper, they have the additional option of choosing recyclable paper over plastic—in sync with the growing demand for environmentally responsible electronics packaging options. If you are ready to try a new approach to ESD packaging for electronics, contact Cortec® today.

Tags: CortecEcoSonic® ESD Paper
Nimish

Nimish

Join Our Newsletter

* indicates required
Electronics Era

Electronics Era, India's no.1 growing B2B news forum on Electronics and Cutting Edge Technology is exploring the editorial opportunity for organizations working in the Electronics Manufacturing Services(EMS) Industry.

Follow Us

Browse by Category

  • 5G testing
  • 5G/6G
  • AC-DC/DC-DC Converters
  • ADAS
  • Aerospace & Defence
  • AI/ML
  • Automation
  • AUTOMOTIVE ELECTRONICS
  • Big Data Analytics
  • Blockchain
  • Cloud Computing
  • Component
  • Connected Cars
  • Data Center
  • Editor's Desk
  • EE-Tech Talk
  • Electronics Components
  • Embedded
  • EVs
  • Future Tech
  • HEVs
  • Industry 4.0
  • Industry News
  • IoT-Internet of Things
  • LED & Lighting
  • LEDs
  • Manufacturing
  • Market Research
  • Medical Electronics
  • Mosfets
  • News
  • Oscilloscopes
  • Policy
  • Power Electronics
  • Product News
  • RENEWABLES
  • RF & Wireless
  • Robotic
  • SDN & NFV
  • Security
  • Semiconductor
  • Sensor
  • Smart Machine
  • SMT/PCB/EMS
  • Sustainability
  • T & M
  • Tech Article
  • Tech Blog
  • TECH ROOM
  • Telecom
  • Uncategorized
  • VR / AR
  • White Papers

Recent News

Naveen Goyal

Meritto Launched Mio AI, the Autonomous Agent Suite Purpose-Built for Education

June 6, 2025
Panasonic

Panasonic Collaboration with MeitY Nasscom CoE to Accelerate Innovation in Smart Residential Living

June 6, 2025
  • About Us
  • Advertise with Us
  • Contact Us

© 2022-23 TechZone Print Media | All Rights Reserved

No Result
View All Result
  • News
    • Industry News
    • Product News
  • TECH ROOM
    • Sensor
    • VR / AR
    • Embedded
    • Medical Electronics
    • Industry 4.0
    • Robotic
    • Automation
    • Smart Machine
    • Component
    • Manufacturing
    • Aerospace & Defence
    • Security
    • Policy
  • Semiconductor
    • AUTOMOTIVE ELECTRONICS
      • EVs
      • HEVs
      • ADAS
      • Connected Cars
    • IoT-Internet of Things
      • Development Kit
      • IoT Design
    • Power Electronics
      • AC-DC/DC-DC Converters
      • Mosfets
      • IGBTs
      • LEDs
  • T & M
    • 5G testing
    • Oscilloscopes
    • SDN & NFV
    • RF & Wireless
  • AI/ML
  • Telecom
    • 5G/6G
  • RENEWABLES
    • Sustainability
  • Future Tech
    • Data Center
    • Cloud Computing
    • Big Data Analytics
  • Webinars
  • Editor’s Pick
    • Tech Article
    • Tech Blog
    • White Papers
    • EE-Tech Talk
    • Market Research
  • EE Awards
    • EE Awards 2025
    • EE Awards 2024
  • MORE
    • E-Mag
    • Events
    • Subscription
    • Contact Us

© 2022-23 TechZone Print Media | All Rights Reserved

Advertisement
Advertisement