Oxfordshire, UK – Direct Insight the UK-based technical systems integrator and reseller of system-on-module (SoM) and other embedded systems can now deliver tiny, low-cost QSMP-13 solder-down QFN-style System-on-Module SoMs featuring the STMicro STM32MP135C.
Commented David Pashley, CEO of Direct Insight: “The QSMP-13 is our lowest-cost module, with a volume price of close to £20. Despite that, it’s got a good range of interfaces and is available as a solder down module which makes it very easy to design in: developers can even create a simple 2-layer baseboard.”
Manufactured by Direct Insight’s long-standing partner, Ka-Ro Electronics, the QSMP module family’s STM32MP1 processors deliver both high performance via the QSMP-15’s STM32MP157A with dual 650MHz ARM Cortex-A7 core and GPU, and very low cost thanks to the STM32MP135C single core version – the QSMP-13. Also included are RAM, Flash memory and power management. All modules offer an extended temperature spec of -25°C to +85°C, single 3.3-5V supply and production-ready Linux BSP within a Yocto package. The module’s a wide range of connectivity options includes CANbus, UART (x5), SPI (x2), I2C (x2), Audio, Gb Ethernet, SD, USB Host and Client and a parallel RGB display.
Packaged as a 27mm x 27mm device measuring 2.3mm high, the solder-down configuration of the QSMP-13 employs a QFN-type pinout style which features a 1mm pitch with 100 edge-located pads, which permit simple 2-layer baseboards if required. Modules can be soldered directly to a baseboard, eliminating unnecessary connectors, while improving thermal efficiency and saving space. Optimized layout minimizes EMI problems. The single-sided design means that no components are subjected to 3rd reflow pass and there are no buried contacts that require X-Ray inspection. Therefore the modules are ideal for rugged environments.
The QSMP comes with a dedicated development system, equipped with Linux BSP.
