Electronics Era

  • About Us
  • Advertise with Us
  • Contact Us
  • e-Mag
  • Webinars
Header logo on website
Advertisement
Advertisement
Menu
  • News
    • Industry News
    • Product News
  • TECH ROOM
    • Sensor
    • VR / AR
    • Embedded
    • Medical Electronics
    • Industry 4.0
    • Robotic
    • Automation
    • Smart Machine
    • Component
    • Manufacturing
    • Aerospace & Defence
    • Security
    • Policy
  • Semiconductor
    • AUTOMOTIVE ELECTRONICS
      • EVs
      • HEVs
      • ADAS
      • Connected Cars
    • IoT-Internet of Things
      • Development Kit
      • IoT Design
    • Power Electronics
      • AC-DC/DC-DC Converters
      • Mosfets
      • IGBTs
      • LEDs
  • T & M
    • 5G testing
    • Oscilloscopes
    • SDN & NFV
    • RF & Wireless
  • AI/ML
  • Telecom
    • 5G/6G
  • RENEWABLES
    • Sustainability
  • Future Tech
    • Data Center
    • Cloud Computing
    • Big Data Analytics
  • Webinars
  • Editor’s Pick
    • Tech Article
    • Tech Blog
    • White Papers
    • EE-Tech Talk
    • Market Research
  • EE Awards
    • EE Awards 2025
    • EE Awards 2024
  • MORE
    • E-Mag
    • Events
    • Subscription
    • Contact Us
Home TECH ROOM Embedded

PICMG Announce COM Express 3.1 Specification to Support Ultra High-Speed Serial Interfaces

Meeting Edge Workload Demands

Editorial by Editorial
November 9, 2022
in Embedded
Reading Time: 2 mins read
Express ADPF
Share on FacebookShare on TwitterShare on LinkedIn

WAKEFIELD, MA.,- PICMG announces that the new COM Express 3.1 specification has been ratified to support high-speed serial interfaces such as PCIe Gen 4 and USB4. These new interfaces will allow COM Express to continue to fill its role as the leading Computer-on-Module (COM) standard for performance-rich client systems. To support such high-speed signaling, an updated 16 Gbps connector has been specified across the family’s Type 6, 7, and 10 pinouts. SATA Gen 3 signal integrity and loss budget information have also been added for each Type. These improvements join pinout-specific upgrades including optional USB4 (Type 6), MIPI-CSI connectors (Types 6, 10), SoundWire (Types 6, 10), as well as an additional general-purpose SPI interface (Types 6, 10). A CEI signaling-enabled 10 GbE interface and IPMB management interface are also now defined in the Type 7 pinout as part of COM.0 R3.1.

“The PICMG COM Express specification just had its 17th anniversary. During this time, the specification has been updated to support the latest interfaces while focusing on maintaining backwards compatibility. Revision 3.1 is no exception,” says Jeff Munch, CTO of ADLINK Technology and Chairman of the COM Express subcommittee. “In the latest release of the COM Express specification, the subcommittee has added support for PCI Express Gen 4, USB4, and newer 10G side-band interfaces while maximizing backwards compatibility.”

COM Express Revision 3.1 Type 6 and Type 10 hardware is fully backward compatible with 3.0 modules and carrier boards, while Revision 3.1 Type 7 modules are backward compatible apart from 10GBASE-KR Ethernet side-band signals and a second PCIe reference clock not included on R3.0 modules.

For more on the COM Express family of specifications, go to www.picmg.org/openstandards/com-express, or purchase the latest specification revision from www.picmg.org/product/com-express-module-base-specification-rev-3-1.

More on PICMG’s range of open, modular computing standards can be found at www.picmg.org.

Tags: ADLINK TechnologyCOM Express 3.1embedded computingPICMG
Editorial

Editorial

Join Our Newsletter

* indicates required
Electronics Era

Electronics Era, India's no.1 growing B2B news forum on Electronics and Cutting Edge Technology is exploring the editorial opportunity for organizations working in the Electronics Manufacturing Services(EMS) Industry.

Follow Us

Browse by Category

  • 5G testing
  • 5G/6G
  • AC-DC/DC-DC Converters
  • ADAS
  • Aerospace & Defence
  • AI/ML
  • Automation
  • AUTOMOTIVE ELECTRONICS
  • Big Data Analytics
  • Blockchain
  • Cloud Computing
  • Component
  • Connected Cars
  • Data Center
  • Editor's Desk
  • EE-Tech Talk
  • Electronics Components
  • Embedded
  • EVs
  • Future Tech
  • HEVs
  • Industry 4.0
  • Industry News
  • IoT-Internet of Things
  • LED & Lighting
  • LEDs
  • Manufacturing
  • Market Research
  • Medical Electronics
  • Mosfets
  • News
  • Oscilloscopes
  • Policy
  • Power Electronics
  • Product News
  • RENEWABLES
  • RF & Wireless
  • Robotic
  • SDN & NFV
  • Security
  • Semiconductor
  • Sensor
  • Smart Machine
  • SMT/PCB/EMS
  • Sustainability
  • T & M
  • Tech Article
  • Tech Blog
  • TECH ROOM
  • Telecom
  • Uncategorized
  • VR / AR
  • White Papers

Recent News

Lam Research

First of Its Kind: Dextro Cobot Wins Best of Sensors Award for Revolutionizing Fab Maintenance

June 27, 2025
DC-DC-Power-Converter

Microchip Expands its Space Portfolio with the SA15-28 DC-DC Power Converter and Companion SF100-28 EMI Filter

June 27, 2025
  • About Us
  • Advertise with Us
  • Contact Us

© 2022-23 TechZone Print Media | All Rights Reserved

No Result
View All Result
  • News
    • Industry News
    • Product News
  • TECH ROOM
    • Sensor
    • VR / AR
    • Embedded
    • Medical Electronics
    • Industry 4.0
    • Robotic
    • Automation
    • Smart Machine
    • Component
    • Manufacturing
    • Aerospace & Defence
    • Security
    • Policy
  • Semiconductor
    • AUTOMOTIVE ELECTRONICS
      • EVs
      • HEVs
      • ADAS
      • Connected Cars
    • IoT-Internet of Things
      • Development Kit
      • IoT Design
    • Power Electronics
      • AC-DC/DC-DC Converters
      • Mosfets
      • IGBTs
      • LEDs
  • T & M
    • 5G testing
    • Oscilloscopes
    • SDN & NFV
    • RF & Wireless
  • AI/ML
  • Telecom
    • 5G/6G
  • RENEWABLES
    • Sustainability
  • Future Tech
    • Data Center
    • Cloud Computing
    • Big Data Analytics
  • Webinars
  • Editor’s Pick
    • Tech Article
    • Tech Blog
    • White Papers
    • EE-Tech Talk
    • Market Research
  • EE Awards
    • EE Awards 2025
    • EE Awards 2024
  • MORE
    • E-Mag
    • Events
    • Subscription
    • Contact Us

© 2022-23 TechZone Print Media | All Rights Reserved

Advertisement
Advertisement