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Home TECH ROOM SMT/PCB/EMS

The Adaptsys Group Introduces 3DInspect for Automated Carrier Tape Inspection and CoC Reporting

Nimish by Nimish
February 5, 2026
in SMT/PCB/EMS
Reading Time: 2 mins read
Adaptsys Group

Adaptsys Group 3DInspect

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Hampshire, UK – The Adaptsys Group has introduced 3DInspect, an automated inspection system designed to simplify carrier tape verification and significantly reduce the time required to generate Certificates of Conformance (CoCs). The system will be featured at the 2026 IPC APEX EXPO in March.

3DInspect replaces manual inspection and documentation with a consistent, automated process that measures carrier tape pockets and generates inspection reports in minutes. Tasks that traditionally take up to 30 minutes per reel can now be completed in approximately one minute, helping manufacturers improve throughput while reducing operator variability and documentation burden.

Designed for manufacturers handling sensitive or high-value components, 3DInspect supports quality and traceability requirements where carrier tape accuracy directly impacts downstream assembly and customer acceptance. Automated measurement and reporting improve repeatability and provide clear documentation that can be shared with customers or retained for quality records.

“As one of the most established carrier tape producers in the US, Mid-America Tape and Reel has built its reputation on uncompromising quality,” said Barbara Pauls, President/CEO, Mid-America Tape and Reel. “We are an early adopter of the 3DInspect system because it offered the automated, repeatable precision our standards demand. The system has streamlined our inspection process significantly, and the automatic generation of Certificates of Conformance has saved us substantial time and effort.”

While 3DInspect can be deployed as a standalone inspection solution, it also fits naturally into automated tape-and-reel workflows. At APEX, Adaptsys will highlight 3DInspect, demonstrating how automated inspection can complement tape-and-reel systems in high-throughput packaging environments.

For more information, visit www.adaptsys.com.

Tags: 3DInspectAdaptsys Group
Nimish

Nimish

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