TOKYO, Japan — Renesas Electronics Corporation has announced its third‑generation (Gen 3) DDR5 Multiplexed Rank Dual In‑Line Memory Module (MRDIMM) chipset solutions, delivering DDR5 server-class MRDIMM speeds up to 16,000 mega transfers per second (MT/s). The new solutions are designed to address the growing demand for higher memory bandwidth driven by artificial intelligence (AI) data centers, cloud infrastructure and accelerated compute workloads.
Renesas will showcase memory interface components for Gen 3 MRDIMMs at FMS 2026 (Future of Memory and Storage Conference), Santa Clara, California, August 4-6, 2026 (Booth #807). They include third‑generation Multiplexed Registering Clock Driver (MRCD, RRG5013) and Multiplexed Data Buffer (MDB, RRG5103) devices that support next‑generation MRDIMM performance.
As AI models grow larger and compute workloads become more data-intensive, system architects face increasing challenges in delivering higher memory bandwidth while preserving compatibility with existing server platforms. Renesas’ Gen 3 MRDIMM solutions deliver 25% higher memory bandwidth than its second-generation solutions, while continuing to use existing DDR5 infrastructure. As a result, server platforms can extract more performance without disruptive architectural changes.
Renesas continues to deliver a field-proven, production-ready MRDIMM platform, spanning MRCD, MDB, Power Management ICs (PMIC), Serial Presence Detect (SPD) Hubs and temperature sensors. This platform approach enables customers to scale MRDIMM performance across generations while maintaining design continuity and accelerating deployment.
MRDIMM Gen 3 builds on the proven MRDIMM architecture introduced with Gen 2, extending performance and preserving standard DIMM form factors and system compatibility. Gen 3 also introduces enhancements to system visibility and robustness, including Device Equalization Self-Train Mode (DESTM) Quality Indication Status, which enables users to fine-tune timing and receiver equalization training to maximize margins.
In addition to performance gains, Renesas MRDIMM Gen 3 solutions are designed with system‑level power efficiency in mind, helping customers balance increasing bandwidth requirements with thermal and power constraints at the system level. Detailed power comparisons will be provided in the accompanying product documentation.
“AMD has a long history of supporting open, standards-based technologies that power data center innovation and deliver greater flexibility as AI and HPC workloads continue to evolve,” said Amit Goel, Corporate Vice President, Compute and Enterprise AI Platform Solutions Engineering, AMD. “Innovations in next-generation memory form factors such as MRDIMM and Renesas’ chipset are important to helping the industry deliver higher bandwidth, greater efficiency and continued platform scalability.”
“AI training and inferencing workloads are fundamentally reshaping system memory requirements for data center infrastructure,” said Sameer Kuppahalli, Vice President and General Manager, Memory Interface Division at Renesas. “To meet the insatiable appetite of these workloads for memory capacity and throughput, Renesas continues to lead the industry by delivering our 3rd generation of chipset components for MRDIMM. Our customers employ Renesas’ complete chipset components in order to further push the frontiers of memory throughput and capacity.”
Renesas is working closely with leading CPU and platform partners to enable MRDIMM Gen 3 adoption in future server platforms, reinforcing MRDIMM as a scalable memory architecture for next‑generation AI and cloud infrastructure.
Availability
Renesas MRDIMM Gen 3 MRCD (RRG5013x) and MDB (RRG5103x) are sampling to select customers today, including all major DRAM suppliers. Production availability is expected in 2H/2027. More information about Renesas’ memory interface solutions is available at www.renesas.com/ddr5. To request additional details about the new products, please send an email to mid@lm.renesas.com or visit http://www.renesas.com/.
