Bensheim – As India’s automotive industry advances toward electrification, connected mobility and software-defined vehicles, the demands placed on vehicle architectures continue to grow. Higher data rates, increasing electronic complexity and evolving low- and high-voltage systems require reliable connectivity solutions that support performance, scalability and integration.
At electronica India 2026, taking place from September 16-18, 2026, at the Bangalore International Exhibition Centre (BIEC), Bangalore (Hall 5 | Booth H5.B81), TE Connectivity will showcase technologies designed to support next-generation vehicle architectures. The focus will be on solutions for signal and power transmission, high-speed data connectivity and e-mobility applications that address the evolving needs of the automotive industry.
Key solutions on display include:
Signal & Power Connectivity Solutions for modern vehicle architectures
Data Connectivity Solutions supporting connected and data-intensive vehicle applications
E-Mobility Solutions for electrified powertrains and high-voltage systems
Performance Materials for protection, insulation and reliability in demanding automotive environments
Miniaturized Connectivity Solutions to help optimize space and system integration
Inside Device Connectivity Solutions for connecting electronic components within increasingly complex automotive systems
Automotive experts Vinod Viswanath, SPC Product Manager, Low Voltage Headers, and Dominik Schmitt, SPC Product Manager, Inside Device Connectivity, will also be available for interviews and background discussions on current developments in automotive electronics.
Possible interview topics include:
Miniaturization and modular hybrid designs for next-generation vehicle architectures
The growing role of connectivity in software-defined and connected vehicles
Managing increasing electronic complexity through advanced connectivity solutions
Inside device connectivity and integration trends in modern automotive systems
