Bangalore – VIAVI Solutions will showcase its end-to-end data center portfolio for foundational silicon technologies, modules and systems testing at booth 1001 at ECOC 2026 from September 21-23 at the FYCMA exhibition center in Malaga, Spain.
Hyperscalers and cloud providers continue to push the boundaries of network speed and capacity as they scale AI infrastructure. 1.6T technologies are being deployed within the rack (scale-up), across clusters (scale-out) and between data centers (scale-across), with planning for 3.2T underway. These technologies rely on 16x224G and 8x448G lane architectures enabled through advanced Silicon Photonics (SiPh), Co-packaged Optics (CPO) and robust optical connectivity. AI infrastructure is driving unprecedented growth in fiber density, accelerating the expansion of fiber interconnects and multifiber connectivity. In addition, quantum technologies are impacting security assumptions, driving significant increases in system-level test complexity.
VIAVI addresses these test challenges at every stage, from design and production to deployment and monitoring.
Design Validation: At ECOC 2026, VIAVI will showcase its latest advanced fabric validation technologies for L0 to L3 High-Speed Ethernet (HSE) testing, including:
ONE LabPro ONE-1600: the industry’s first fully integrated test solution for pluggable 1.6T transceivers now supports a flexible new configuration, with both IHS and RHS interfaces in the same module. Also on display is the new ONE-1600 ERP 1.6T module for network equipment manufacturers and production use cases, sized for these environments with a core feature set at a reduced price point.
TestCenter D2: enabling comprehensive AI workload testing of 1.6T Layers 2 and 3, the platform identifies interconnect bottlenecks, latency hotspots and fault-tolerance gaps that limit GPU utilization and hinder AI cluster scalability. It is the industry’s first Ultra Ethernet Transport (UET) validation solution for AI fabric validation across the Ultra Ethernet ecosystem.
Manufacturing Test: VIAVI’s MAP-300 platform will feature several new products for CPO and SiPh testing. Engineered for the high-density demands driven by connectivity, silicon test insertions and sub-system manufacturing, the MAP-300 now includes a Remote Head Polarity Mapper, a High-Density Variable Optical Attenuator (HD VOA), a High-Density Optical Power Meter (HD OPM) and a High-Density In-Line Optical Power Meter (HD IL-OPM). The platform also supports quantum key distribution (QKD) and hybrid network evaluation.
For the first time, VIAVI will present its optical connector end-face geometry test solutions from the acquisition of the Direct Optical Research Company (DORC) product line. The fiber surface topology measurement products round out VIAVI’s interferometry, inspection and cleaning portfolio for connectivity manufacturers.
Deployment and Monitoring: VIAVI will introduce the MAP-2800 test head for standalone operation and centralized testing with the Fusion test system. It is the industry’s first rack-mounted tester for Ethernet applications for centralized and field testing from 10M to 800G. It integrates seamlessly with other VIAVI handheld testers, test heads, virtual agents or smart Small Form-factor Pluggables (SFPs) for lower bandwidth sites, automating processes and minimizing truck rolls.
VIAVI will demonstrate the DCX-700 test set for automated tier-1 certification and validation for high fiber-count networks, helping data center operators deploy large-scale MPO/MMC-based connectivity faster and with greater confidence. VIAVI will also showcase its expanding portfolio for testing Hollow Core Fiber (HCF) with T-BERD/MTS-4000 and OneAdvisor800, which support the industry’s drive toward lower latency and higher performance optical infrastructure through advanced characterization, qualification and monitoring solutions.
