SHENZHEN, China – The 27th China International Optoelectronic Exposition (CIOE 2026) officially opened today at the Shenzhen World Exhibition & Convention Center, marking the largest edition in the event’s history. As a premier global platform for the optoelectronics industry, this year’s exhibition arrives at a pivotal moment when photonics technology has become the critical backbone for the rapidly expanding global artificial intelligence (AI) infrastructure.
Running from September 9 to 11, CIOE 2026 has evolved beyond a standalone exhibition into a massive 340,000-square-meter “Mega Show” through strategic co-location with the International Integrated Circuit Innovation Expo (IICIE) and Shenzhen International Electronics & Embedded Expo (elexcon). This tri-show convergence brings together over 5,000 exhibitors and is projected to attract more than 240,000 professional attendees from over 30 countries and regions, transforming the venue into a comprehensive industrial ecosystem connecting photonics, semiconductors, and electronics.
The spotlight at CIOE 2026 falls squarely on the Information and Communication Expo, which has evolved into the definitive showcase for addressing the bandwidth, power, and density bottlenecks of AI computing clusters. As large language models and AI training clusters expand to hundreds of thousands of GPUs, traditional copper interconnects are reaching fundamental physical limits. The industry consensus is clear: the future of AI infrastructure is optical.
This year’s show floor demonstrates the industry’s rapid shift toward high-speed photonics. Leading manufacturers are showcasing the full spectrum of enabling technologies:
- High-Speed Optical Modules: Following the large-scale commercialization of 800G modules, the industry is now accelerating toward 1.6T and beyond. LightCounting projects 800G and 1.6T modules to reach a combined market of approximately $14.6 billion in 2026, accounting for roughly 64% of the optical module market. Chinese module makers are advancing rapidly, with major players demonstrating complete 400G-to-1.6T lineups built on silicon photonics and thin-film lithium niobate, alongside next-generation approaches such as LPO, NPO, and CPO.
- Next-Generation Optical Engines and Chips: CIOE 2026 features advanced solutions from global technology leaders, including POET Technologies showcasing its high-power laser light sources for AI interconnects. Domestic champions like ZJEAGLES COMSEMI Semiconductor are presenting GaAs and InP dual-material-system products covering both AI optical interconnect and physical AI applications.
- Silicon Photonics and CPO Solutions: Co-packaged optics (CPO) and silicon photonic integrated circuits (PICs) are taking center stage as critical enablers for reducing power consumption and increasing interconnect density. Equipment providers such as ASMPT are demonstrating high-precision die bonding and multi-chip integration solutions that address the key challenge of transitioning CPO from technology validation to stable, repeatable, and scalable mass production.
- The Complete Computing Chain: Thanks to the three-show convergence, visitors can explore the entire AI computing value chain in one venue from silicon photonic chip fabrication and advanced packaging to high-speed optical interconnects, HBM memory, power delivery, and data center system clusters.
Eight Thematic Expos Covering the Full Photonics Spectrum
Beyond the information and communication sector, CIOE 2026 features seven additional thematic expos that together cover the entire optoelectronics ecosystem:
- Precision Optics & Camera Technology Expo: Focused on AI-powered computational optics, this expo showcases optical materials, optical lens, camera modules, test and measurement equipment, and optical imaging system driving innovations in consumer electronics, automotive vision, medical, and industrial machine vision.
- Laser Technology & Intelligent Manufacturing Expo: Presenting laser sources, intelligent laser equipment, and automated precision production lines that are transforming manufacturing across semiconductors, new energy, and industrial automation.
- Infrared Applications Expo: Highlighting the convergence of AI and infrared thermal imaging, with commercial applications in in-vehicle perception, drone surveillance, industrial quality inspection, security, and robotics.
- Intelligent Sensing Expo: Covering LiDAR, 3D sensing, spectral sensing, and industrial sensors for intelligent driving, robotics, consumer electronics, smart homes, and environmental monitoring.
- Display Technology Expo: Featuring Mini/Micro LED, advanced display materials, intelligent display modules, automotive displays, and flexible displays with AI-powered image optimization and dynamic power management.
- AR & VR Expo: Showcasing AI glasses, Pancake VR optical architectures, metasurface optical components, and AI-simulated optical path systems for next-generation immersive experiences.
- Photonics Innovation Expo: Bringing together technology startups, research institutes, and university-led commercialization projects to bridge the gap between laboratory research and market applications.
Specialized Featured Zones and Real-World Demonstrations
CIOE 2026 features several dedicated product and technology zones that provide hands-on exposure to cutting-edge applications. These include the Automotive Optical Communication Zone, Embodied Robot Zone, Automotive Display Zone, XR Glasses Teardown Zone, Telescope and Astronomical Equipment Zone, Laser Medical Aesthetics Zone, and multiple Advanced Manufacturing Zones covering laser welding and optical precision fabrication.
90+ Forums Bringing Global Industry Insight
Complementing the expansive exhibition, CIOE 2026 hosts over 90 concurrent forums and conferences that bring together industry leaders, academic experts, and investment professionals. Flagship events include the Information Communication Industry Forum, the Optics Industry Forum, and the Laser Industry Forum, covering topics from high-speed optical transmission and AI computing interconnects to computational optical imaging and precision manufacturing. International partners including Yole Group, the European Photonics Industry Consortium, and ePIXfab are contributing global perspectives on market trends and technology roadmaps.
CIOE 2026 has truly become the strategic nexus where the photonics and AI industries converge. With the explosive growth of AI infrastructure, optical interconnect has shifted from a supporting technology to a core strategic asset. This year’s three-show convergence creates an ecosystem that addresses the complete AI computing chain from semiconductor manufacturing and advanced packaging to high-speed optical interconnects and system deployment. We are proud to be the platform where the industry comes together to drive innovation, tackle challenges, and build the future of computing.
CIOE 2026 will continue through September 11 at the Shenzhen World Exhibition & Convention Center. For more information, please visit the official CIOE website at www.cioe.cn/en.
