Łódź, Poland: TME (Transfer Multisort Elektronik Sp. z o.o.), – The global, multimillion dollar revenue stockholding distributor of electronic components, has expanded its offering with the inclusion of versatile Raytac Bluetooth Low Energy (BLE) modules. Supporting wireless ecosystems, these ready-made modules integrate the radio system, microcontroller and essential peripheral components to simplify hardware development across IoT, medical electronics, and industrial automation.
Built on Nordic Semiconductor SOCs, featuring Arm Cortex-M4F or Cortex-M33 cores, the Raytac modules offer from 192kB up to 1.5MB of program memory and up to 256kB of RAM. This amount of memory is sufficient for the chip to handle both communication and the main application.
The modules support BLE in versions from 4.0 to 6.2 with communication speeds of up to 2Mb/s, as well as Long Range modes of 500kb/s and 125kb/s. Selected modules based on nRF54 systems also support proprietary transmission in the 2.4GHz band with speeds of up to 4Mb/s. The maximum transmitter power is 4, 6 or 8dBm, depending on the model, while the receiver sensitivity reaches -103dBm. In addition to BLE communication, the hardware platform can work with ANT+, Thread and Zigbee protocols, as well as the IEEE 802.15.4 standard.
Built-in AES-128 encryption (using a cryptographic coprocessor) facilitates the protection of transmitted data, which will be particularly useful in projects focusing on security. The modules can be powered by a supply voltage from 1.7V to 5.5V DC and operate in temperatures from -40°C to +105°C. Such a wide range of parameters allows the modules to be used in both household devices and equipment intended for operation in more challenging outdoor conditions.
Raytac modules provide from 8 to as many as 48 configurable I/O lines and several analogue-to-digital converter (ADC) channels. Additionally, the modules support the major interfaces found in embedded devices: UART, I2C, I2S, SPI, QSPI, PDM, USB, and NFC, enabling the SoC to be directly connected to sensors, memory or a display.
Each module is placed on a small PCB designed for surface mounting inside a larger device. Within individual series based on the same system, the modules maintain the same pin layout but may differ in antenna implementation. The antenna can be chip-based, located on the laminate itself, or external, in which case the module has a dedicated u.FL connector for it. Differences in pin layout appear between different series of modules.
“Designing an RF path from scratch involves costly and time-consuming testing procedures,” says Marcin Cichomski, Head of Semiconductor Product Group TME. “By making pre-tested and certified Raytac modules readily available in our catalogue, we enable engineers to streamline their design phase, bypass complex radio certification hurdles, and bring robust connected products to market faster.”
Visitors interested in exploring Raytac’s Bluetooth Low Energy module lineup are invited to meet the TME team at electronica in Munich, located at Booth 361, Hall B5.
For more information on the Raytac BLE modules, please visit:
https://www.tme.eu/de/en/
