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Home TECH ROOM SMT/PCB/EMS

Microscreen, SMTA Connecticut Chapter to Host Open House at New Stencil Manufacturing Facility

Vishaka Vardhan by Vishaka Vardhan
November 10, 2026
in SMT/PCB/EMS
Reading Time: 2 mins read
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Oxford, CT – Microscreen is inviting customers and electronics manufacturing professionals to an open house at its new Oxford, Connecticut manufacturing facility on Thursday, Dec.10, 2026 from 4 to 7 p.m. Hosted in conjunction with the SMTA Connecticut Chapter, the event will include a facility tour, a technical presentation from KOKI Solder America Inc. and an opportunity to meet the Microscreen team.

The event is free, but attendance is limited to 50 people.

Register here: https://smta.org/events/EventDetails.aspx?id=2095886&group=225183.

The new Oxford facility opened earlier this year to provide faster stencil production and delivery to customers throughout the Northeast. The location manufactures laser-cut SMT stencils, including step stencils, and offers 24-hour turnaround. UPS Ground shipping reaches many locations from Maine to Philadelphia in one day.

Visitors will get a firsthand look at stencil manufacturing, from laser cutting and inspection to quality control. Jeff Poulos, East Coast Regional Manager, and other members of the Microscreen team will be available to answer questions about stencil design, manufacturing and nanocoatings.

Todd Gilmore, President of AGI Corporation, will also attend and be available to answer questions about PCB assembly tooling.

Text Box: Jeff Poulos, Eastern Regional Operations Manger“We’re excited to have everyone out to the new facility,” said Jeff Poulos, Eastern Regional Operations Manager, Microscreen. “A lot of work has gone into getting it up and running, and it’ll be great to show people what we’re doing here. We’re also looking forward to catching up with customers and meeting some new faces.”

The afternoon will include a technical presentation by Shantanu Joshi, Head of Customer Solutions and Operational Excellence at KOKI Solder America Inc., titled “Reliability Evaluation of Low Silver Solder Alloy Paste.”

With rising silver prices affecting solder costs, Joshi will discuss research into a low-silver alloy containing nickel and bismuth as an alternative to SAC305, including solderability, thermal cycling, joint reliability and mechanical shock resistance.

Following the Open House, attendees are invited to continue the conversation at the Wyndham Southbury, where Microscreen and the SMTA Connecticut Chapter will each host a round of drinks.

The Open House will take place at 325 Riggs St., Oxford, CT 06478.

For more information about Microscreen, visit www.microscreen.com.

Tags: SMT solder stencils
Vishaka Vardhan

Vishaka Vardhan

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