StenTech will introduce its new Advanced Nano Coating at the 2023 IPC APEX EXPO, scheduled to take place Jan. 24-26, 2023 at the San Diego Convention Center in California. Additionally, the company will have its complete product line of various stencils and tooling on display – Meet with the StenTech team in Booth #2150!
With the continued miniaturization of electronic packaging, the challenge continues to have the ability to get enough solder paste down in the right geometry shape to not only place the component to solder, but also to meet the ever-changing IPC requirements.
Advanced Nano is a highly unique coating that is applied to the bottom side of the stencil and inside the apertures, the squeegee side remains uncoated. This coating provides the stencil with anti-adhesion properties. Advanced Nano utilizes a specialized 1-3 um hardened nano coating. This permanent hydrophobic and oleophobic coating repels solder flux, allowing increased transfer of paste.
Advanced Nano increases transfer efficiency up to 25 percent, and enables significantly less bridging due to its paste efficiency benefits. Due to the anti-adhesion or “non-stick” characteristics, underside cleaning is reduced, giving customers a better yield and less expense on rework and touch-up. Stencils coated with Advanced Nano are ready for use just 30 minutes after coating.
StenTech has been leading the way in stencil technology, being the first company to introduce Fiber Diode lasers into North America. With more than 30 experienced CAD designers, their strength is the support they provide in stencil modifications, materials and thickness recommendations. StenTech offers a complete array of stencil technology, custom-tailored to suit your manufacturing requirements. They manufacture all types of stencils for the SMT industry.
To learn more, visit www.StenTech.com or www.photostencil.com.
