Detroit Engineered Products (DEP), the creators of DEP MeshWorks, an integrated CAE platform, is pleased to announce the successful conclusion of...

KYOCERA AVX released the new 9258-100 Series spring-finger board-to-board compression contacts. Designed to provide full connector functionality in a miniature,...

KT successfully demonstrated 5G non-terrestrial network (NTN) technology in a satellite communication environment with long propagation delays. It used a...

STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, has introduced the Teseo VI family of global...

Munich, Germany – Devices and systems – from automotive and industrial to consumer electronics – rely on powerful, efficient, and...

How to engage young learners and introduce them to coding? The most fun option is by playing games. Starting 2023, ST...

ROHM has developed 650V GaN HEMTs in the TOLL (TO-LeadLess) package: the GNP2070TD-Z. Featuring a compact design with excellent heat...

Embedded developers must address the challenge of designing systems that achieve a balance between compactness, energy efficiency and high performance....

Munich, Germany – SECORA Pay Green by Infineon Technologies AG paves the way for more sustainable payment cards. This innovation...

(Waterbury, CT USA) – Alpha Assembly Solutions (a legal entity of MacDermid Alpha Electronics Solutions), Heraeus Electronics, and Henkel have successfully...