Munich, Germany – Infineon Technologies AG has announced two new CoolGaN™ product technologies, CoolGaN bidirectional switch (BDS) and CoolGaN Smart...

TOKYO, Japan and HYDERABAD, India ― Renesas Electronics Corporation and the Indian Institute of Technology Hyderabad (IITH) have signed a three-year memorandum of understanding...

INDIA– Honeywell has announced an update to incorporate artificial intelligence (AI) and machine learning into its Guided Work Solutions to help...

Cambridge, UK - Cambridge GaN Devices (CGD) has announced two new packages for the company’s ICeGaN™ family of GaN power...

STMicroelectronics and Geely Auto Group has announced they have signed a long-term Silicon Carbide (SiC) supply agreement to accelerate their existing...

Bengaluru, India : element14 is expanding its line of Multicomp Pro offerings to include a variety of 3D printer filaments, catering...

NEW YORK, US and NOIDA—HCLTech has achieved a Scaled Agile Gold SPCT Partner status, reinforcing its commitment to delivering excellence...

STMicroelectronics announces a new high-volume 200mm silicon carbide (“SiC”) manufacturing facility for power devices and modules, as well as test...

Munich, Germany – The electronics industry is witnessing a significant shift towards more compact and powerful systems, driven by technological...

NEW YORK and NOIDA, India—HCLTech has announced that iMRO/4, its maintenance, repair and overhaul (MRO) solution for clients in the transportation,...