STIWA Group will present its smart lock solution SMALOX at the Parcel and Post Fair in Amsterdam
Munich, Germany and Attnang-Puchheim, Austria – STIWA Group will present its smart lock solution SMALOX at the Parcel and Post...
Munich, Germany and Attnang-Puchheim, Austria – STIWA Group will present its smart lock solution SMALOX at the Parcel and Post...
Munich, Germany, and San Jose, California – Infineon Technologies AG has announced the company is extending its AIROC™ portfolio with...
Munich, Germany – At today’s OktoberTech™ Silicon Valley, Infineon Technologies AG has announced the launch of a contactless, privacy-centric sleep...
Munich, Germany – Infineon Technologies AG has announced its new TRAVEO™ T2G Cluster family of automotive microcontrollers (MCU) with a...
Munich, Germany – Infineon Technologies AG has announced that they have signed a strategic partnership to accelerate the future development...
Munich, Germany, and Ottawa, Canada –Infineon Technologies AG has announced the closing of the acquisition of GaN Systems Inc. (“GaN...
Bangalore- R&M is launching a high-density version of the SYNO dome closure. The new SYNO S-500 splice closure opens up...
STMicroelectronics has released the ACEPACK 1DMT-32 family of silicon carbide (SiC) power modules in a convenient 32-pin, dual-inline, molded, through-hole package for automotive...
GOLETA, Calif. ― Teledyne FLIR, part of Teledyne Technologies Incorporated, today announced the Lepton UW, the world’s first micro-thermal camera module...
CHICAGO— Littelfuse, Inc. has announced the release of IXTY2P50PA, the first automotive-grade PolarP™ P-Channel Power MOSFET. This innovative product design...
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