Munich, Germany – Infineon Technologies AG has announced its new TRAVEO™ T2G Cluster family of automotive microcontrollers (MCU) with a...

Munich, Germany – Infineon Technologies AG has announced that they have signed a strategic partnership to accelerate the future development...

Munich, Germany, and Ottawa, Canada –Infineon Technologies AG has announced the closing of the acquisition of GaN Systems Inc. (“GaN...

Bangalore- R&M is launching a high-density version of the SYNO dome closure. The new SYNO S-500 splice closure opens up...

STMicroelectronics has released the ACEPACK 1DMT-32 family of silicon carbide (SiC) power modules in a convenient 32-pin, dual-inline, molded, through-hole package for automotive...

GOLETA, Calif. ― Teledyne FLIR, part of Teledyne Technologies Incorporated, today announced the Lepton UW, the world’s first micro-thermal camera module...

CHICAGO— Littelfuse, Inc. has announced the release of IXTY2P50PA, the first automotive-grade PolarP™ P-Channel Power MOSFET. This innovative product design...

The Importance of Condition Monitoring in Smart Industries Real-time, continuous, condition monitoring and predictive maintenance solutions continue to grow in...

“Internet of Things” () is an extremely popular phrase these days, although it’s wrongly associated primarily with devices such as...

Waters launched its first pipetting robot in 2013 to much acclaim and success. The product won multiple awards over the...