Qualcomm and SES-imagotag Collaborate on Standards-based ESLs
Qualcomm Technologies announced that, in collaboration with SES-imagotag, they are developing technology that enables new electronic shelf labels (ESLs) based...
Qualcomm Technologies announced that, in collaboration with SES-imagotag, they are developing technology that enables new electronic shelf labels (ESLs) based...
The trends toward higher power density and cost optimization dominate the development goals of efficient high-power applications that create substantial...
Flex Power Modules has extended its PKB-D series of isolated eighth-brick DC-DC converters with the launch of the PKB5213D, featuring...
MacDermid Alpha will showcase automotive, 5G infrastructure, mobile devices, film, and surface finishing technologies at the Source India show; Chennai...
Setting up and managing thermal imaging (TI) maintenance programs, with thousands of images covering myriad assets, can be a struggle...
Amtech Systems announced the receipt of multiple follow-on orders for controlled atmosphere belt furnaces for thermal processing of assemblies and...
TDK Corporation has announced the introduction of its new ACT1210E Series (3.2 x 2.5 x 2.5 ㎜ (L x W...
According to Fact.MR, a market research and competitive intelligence provider, the global Motor Driver IC market is likely at US$...
Uno Minda limited (‘Uno Minda’) has announced its results for quarter ended December 31st 2022. At a consolidated level, the...
Thales Alenia Space recently completed the assembly and testing of an engineering model of the solar array for our Space...
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