PICMG announced that the COM-HPC committee has finalized the pinout and dimension definitions for the COM-HPC Mini form factor in...

Mid-range FPGAs and System-on-Chip (SoC) FPGAs have played a major role in moving computer workloads to the network edge. Microchip...

Transition Automation announced an expanded Permalex product line, with the introduction of the S series.  This new product line is...

Thales Alenia Space, the joint venture between Thales (67%) and Leonardo (33%), has completed the assembly, integration and testing (AIT)...

Qualcomm Technologies announced Samsung Electronics has been named the official smartphone partner of the Snapdragon Pro Series. Snapdragon Pro Series competitors...

Gen3 has been selected for a 2022 SMT China Vision Award in the category of Test Equipment for its AutoCAF2+...

Aetina has launched a new ASIC-based edge AI system powered by the programmable Blaize® Pathfinder P1600 Embedded System on Module...

Today, ST is officially becoming a member of MLCommons™, the consortium responsible for benchmarks quantifying machine learning performance in mobile platforms,...

It’s has become an essential prerequisite in times of the ongoing “electrification of everything”: Cars, motorbikes, autonomous buses, construction machines...

Unique, Z-axis compression CIN::APSE interconnects from Cinch providing superior mechanical and electrical performance under the most extreme mechanical shock and...