HONG KONG - XPENG, a leading high-tech smart mobility company, has unveiled its transformative AI Tech Tree upgrade to its strategy to...

HSINCHU, Taiwan –  MediaTek today announced the Dimensity 9400+ SoC, the latest addition to MediaTek’s Dimensity flagship chipset family. Providing...

New Delhi: The Automotive Skills Development Council (ASDC) has signed a Memorandum of Understanding (MoU) with PES University, a renowned Higher...

Public cloud storage has become a core component of enterprise IT strategy, primarily due to its scalability and cost-efficiency. According...

MILPITAS, Calif. – Worldwide sales of semiconductor manufacturing equipment increased 10% to $117.1 billion in 2024 from $106.3 billion in 2023,...

Harwin has announced the winners of its annual Distributor of the Year Award, with Korean connector specialist distributor K2 taking...

MALVERN, Pa. — Vishay Intertechnology, Inc. today that it has extended its LTO series of thick film power resistors with a new...

Conventional printed circuit board (PCB) manufacturing is wasteful, harmful to the environment and energy intensive. This can be mitigated by...

ROHM has developed N-channel power MOSFETs featuring industry-leading* low ON-resistance and wide SOA capability. They are designed for power supplies...

The Industrial Internet of Things (IIoT) relies on comprehensive sensor and process data from the field level. At HMI2025, Pepperl+Fuchs,...