News
AAEON’s BOXER-8645AI Pairs 8 GMSL2 Interfaces with NVIDIA Jetson AGX Orin Power for AMR and In-Vehicle Deployment
Designed for in-vehicle use and utilizing the NVIDIA Jetson AGX Orin platform, the new BOXER-8645AI demonstrates AAEON’s commitment to innovating...
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Infineon Announced the win “GaN Strategic Partner of the Year” Award from Chicony Power Technology
Munich, Germany, and New Taipei, Taiwan,– Chicony Power Technology has announced the winners of its Annual Partner Awards, honoring Infineon...
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HKSTP Companies Exhibit the Latest AI Technology Solutions at InnoEX 2024 and the HKSE Fair (Spring Edition)
HONG KONG SAR - -The Hong Kong Science and Technology Parks Corporation (HKSTP), alongside 25 partner companies, has taken part...
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MediaTek Days on Amazon to Feature Incredible Products For Everyone
New Delhi - MediaTek, a leading global fabless semiconductor powering more than two billion connected edge devices every year, announced the ‘MediaTek...
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Point One Delivers the Precision Platform for Surveyors and Surveying Tool Manufacturers
Point One Navigation — a precision localization and navigation leader — officially launched support for GIS product creators, surveyors, and...
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Renesas Commences Operations of Kofu Factory as Dedicated 300-mm Wafer Fab for Power Semiconductors
TOKYO, Japan ― Renesas Electronics Corporation a premier supplier of advanced semiconductor solutions, today announced that it has started operations at its...
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Global 5G Services Market to Exceed USD 919.4 Billion by 2031, CAGR of 30.8 Percent
The digital landscape is rapidly evolving, with innovations in telecommunications spearheading transformative changes. One such innovation that has been gaining...
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Qualcomm Announces Breakthrough Wi-Fi Technology and Introduces New AI-Ready IoT and Industrial Platforms at Embedded World 2024
Highlights: Qualcomm Technologies’ leadership in connectivity, high performance, low power processing, and on-device AI position is at the center of...
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Congatec Launches New SMARC Modules with Intel Core i3 and Intel Atom x7000RE Processors
Taipei City, Taiwan - congatec presents new rugged SMARC modules based on the Intel Atom x7000RE processor series (codenamed Amston...
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Congatec Introduces 3.5-inch Application Carrier Board for COM-HPC Mini Modules
Taipei City, Taiwan - congatec – a leading provider of embedded and edge computing technology – presents the first board-level...
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Electronics Era, India's no.1 growing B2B news forum on Electronics and Cutting Edge Technology is exploring the editorial opportunity for organizations working in the Electronics Manufacturing Services(EMS) Industry.
