News
Renesas Develope Circuit Technologies for 22-nm Embedded STT-MRAM
TOKYO, Japan ― Renesas Electronics Corporation has announced that it has developed circuit technologies for an embedded spin-transfer torque magnetoresistive random-access...
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Nexperia Announced two ESD Protection Devices
Nijmegen- Nexperia has announced two Electrostatic Discharge (ESD) protection devices optimized for use with retimers and redrivers on high-speed data...
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Flex Announced BMR473 digital Point of Load converter packaged
in a space-saving SIP
SIP or horizontal mount formatInput 6 – 15 VOutput 0.6 – 5 VParallelable up to four unitsPMBus® Flex Power Modules...
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Infineon adds AIROC CYW20820 Bluetooth & Bluetooth LE SoC to its AIROC Bluetooth Portfolio
Munich, Germany – Infineon Technologies AG is adding the AIROC CYW20820 Bluetooth & Bluetooth LE (low energy) system on chip...
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E-PEAS Demonstrates Latest Energy Harvesting Innovations at EW 2022
e-peas will be using this year’s Embedded World exhibition to showcase the breadth of applications empowered by its technology as well...
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Lendlease, PDG Commences Construction on 100 MW Data Centre Campus in Japan
TOKYO- Lendlease and Princeton Digital Group (PDG) today marked the commencement of construction of a 100 MW data center campus...
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Seeed Studio’s reComputer Jetson Development Kits for AI Application Development: Now at Mouser
Mouser Electronics is now stocking the reComputer Jetson 20-1 Xavier NX and reComputer Jetson 10-1 Nano development kits from Seeed Studio. Built with advanced NVIDIA...
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Vishay Announced AEC-Q200 qualified DC-Link metallized polypropylene film capacitor
MALVERN, Pa.— Vishay Intertechnology has introduced a new low profile, AEC-Q200 qualified DC-Link metallized polypropylene film capacitor. Designed to meet...
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Renesas to Acquired Reality AI to Bring Advanced Signal Processing and Intelligence to the Endpoint
Tokyo, Japan― Renesas Electronics Corporation has announced it has entered into a definitive agreement with Reality Analytics, Inc. (Reality AI), a leading provider of embedded...
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NCVET and ESSCI Signed MoU to promote skills & vocational education for electronics industry
New Delhi: The ESSCI - Electronics Sector Skills Council of India has been approved as an awarding body by the...
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Electronics Era, India's no.1 growing B2B news forum on Electronics and Cutting Edge Technology is exploring the editorial opportunity for organizations working in the Electronics Manufacturing Services(EMS) Industry.
