Munich, Germany – Infineon Technologies AG is adding the AIROC CYW20820 Bluetooth & Bluetooth LE (low energy) system on chip...
Read moree-peas will be using this year’s Embedded World exhibition to showcase the breadth of applications empowered by its technology as well...
Read moreTOKYO- Lendlease and Princeton Digital Group (PDG) today marked the commencement of construction of a 100 MW data center campus...
Read moreMouser Electronics is now stocking the reComputer Jetson 20-1 Xavier NX and reComputer Jetson 10-1 Nano development kits from Seeed Studio. Built with advanced NVIDIA...
Read moreMALVERN, Pa.— Vishay Intertechnology has introduced a new low profile, AEC-Q200 qualified DC-Link metallized polypropylene film capacitor. Designed to meet...
Read moreTokyo, Japan― Renesas Electronics Corporation has announced it has entered into a definitive agreement with Reality Analytics, Inc. (Reality AI), a leading provider of embedded...
Read moreNew Delhi: The ESSCI - Electronics Sector Skills Council of India has been approved as an awarding body by the...
Read moreScottsdale, Ariz – VIAVI Solutions Inc. has announced the availability of ApexNow, an app integration between VIAVI Observer Apex and ServiceNow IT Operations Management...
Read moreMunich, Germany – Infineon Technologies AG has announced plans to highlight how it links the real to the digital world...
Read moreSAN FRANCISCO – Trellix, the cybersecurity company delivering the future of extended detection and response (XDR), has its first-ever presence at...
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