Munich, Germany –Türkiye has issued nearly five million next-generation electronic passports with contactless Coil on Module (CoM CL) solution from...
Read moreMunich, Germany, and Paris, France – At TRUSTECH, the tradeshow for innovative payment and identification solutions, Infineon Technologies AG will...
Read moreRenesas Electronics Corporation has expanded its 32-bit microcontroller (MCU) offering with a new RX device for high-end industrial sensor systems....
Read moreLittelfuse announced the launch of its new Pxxx0S3N-A Automotive Grade 3kA SIDACtor® Protection Thyristor Series in DO-214AB (SMC) package. This...
Read moreThe accelerated transition to electric vehicles has led to significant innovations in charging systems that demand more cost-efficient and high...
Read moreMadrid, November – Thales Alenia Space (joint venture between Thales, 67%, and Leonardo, 33%) has signed a contract with TÜBİTAK...
Read moreGRENOBLE, France - Teledyne e2v, a Teledyne Technologies company and global innovator of imaging solutions, announces Emerald™ Gen2, its new state-of-the-art...
Read moreHSINCHU, Taiwan – MediaTek today announced the Dimensity 8300, a power-efficient chipset designed for premium 5G smartphones. As the newest SoC...
Read moreNovakon's NPP Series - The very first certified Panel PC in Siemens Industrial Edge Ecosystem. For machine builders and plant...
Read moreAndover, MA – Vicor Corporation, the leader in high‑performance power modules, speaks with VideoRay, a leading manufacturer of underwater remote...
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