MathWorks and Infineon Technologies AG has announced a hardware support package for the MathWorks Simulink® products for Infineon’s latest AURIX™...
Read morecongatec is pleased to announce that the PICMG COM-HPC technical subcommittee has approved the pinout and footprint of the new...
Read moreMIRTEC will premier its complete line of 3D AOI and SPI Inspection Systems in Booth #1841 at the 2023 IPC...
Read moreStenTech will introduce its new Advanced Nano Coating at the 2023 IPC APEX EXPO, scheduled to take place Jan. 24-26,...
Read moreAAEON announced the RTC-710AP, completing their RTC line of rugged mobile tablet PCs. In addition to the rugged hardware the...
Read moreSTMicroelectronics has released high-power modules for electric vehicles that boost performance and driving range. ST’s new silicon-carbide (SiC) power modules...
Read moreMouser Electronics announced a new eBook in collaboration with Analog Devices exploring the latest innovations in power management and how...
Read moreDiodes Incorporated is targeting growing opportunities in USB Type-C® technology, and lower power operation needs, with two new bit-level retimers....
Read moreIt’s has become an essential prerequisite in times of the ongoing “electrification of everything”: Cars, motorbikes, autonomous buses, construction machines...
Read moreUnique, Z-axis compression CIN::APSE interconnects from Cinch providing superior mechanical and electrical performance under the most extreme mechanical shock and...
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