Vertiv announced the release of the Vertivâ„¢ XR app, a first-of-its-kind tool in the data center space that allows data...
Read moreMaking payments at the beach or while playing sports will become increasingly convenient in the future, as more and more...
Read moreAnritsu Corporation and InterDigital have developed a simulation environment that demonstrates how a user’s experience of an immersive metaverse can...
Read moreRenesas Electronics Corporation has announced that the company is presenting advancements of charging technology for mobile devices at the prestigious...
Read moreAAEON has announced the release of the ZEUS-WHI0 4U Rackmount Whitely Platform Server System. The ZEUS-WHI0 is AAEON’s first system-level...
Read moreSTMicroelectronics has expanded its STM32 family of advanced microcontrollers (MCUs) with extra STM32U5 devices that raise performance while squeezing power...
Read moreHeraeus Electronics is pleased to announce the release of its new Microbond® SMT660 Innolot® 2.0 no-clean printing T4 solder paste....
Read moreNeoCortec, manufacturer of ultra-low-power bi-directional wireless mesh network modules, has signed a new distribution agreement with service-oriented special distributor, Endrich...
Read moreelement14 now stocks NVIDIA® Jetson™, the world's leading platform for autonomous machines and other embedded applications. The range of Jetson...
Read moreSHENMAO America has released its PF735-PQ10-10L Low Melting Point Lead-Free Solder Paste. The paste has been designed specifically for the...
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