Product News

TDK Corporation nnounced the TDK i3 Micro Module, the world’s first module with built-in edge AI and wireless mesh connectivity...

Brooks Automation will exhibit at NEPCON Japan, scheduled to take place Jan. 25-27, 2023, at Tokyo Big Sight. The company...

u-blox has announced the certification of its SARA-R5 series on all the Japan MNOs’ LTE-M networks. The modules are based on u‑blox’s...

ams OSRAM extended its Mira family of pipelined, high- sensitivity, global shutter CMOS image sensors with the launch of the...

Renesas Electronics Corporation has announced its first development kit that includes support for the new Matter protocol. Renesas also announced...

Following the Consumer Electronics Show (CES), AAEON introduced a number of additions to its line of award-winning AI edge solutions,...

Quadric and ams OSRAM has announced a strategic collaboration to develop integrated sensing modules combining ams OSRAM’s leading edge Mira...

Qualcomm Technologies announced the latest addition to the company’s growing Snapdragon® Digital Chassis™ product portfolio with the introduction of the Snapdragon Ride™ Flex...

Mouser Electronics is now stocking the AS7343L 13-channel multi-spectral sensor from ams OSRAM. This compact sensor combines multi-channel color analysis...

TDK Corporation expands its compact and low-power InvenSense SmartIndustrial™ sensor platform family. With its support for extended temperature range of...