Product News

RECOM has achieved a new level of high-efficiency DC/DC performance in a compact 1.6” x 1” x 0.4” package (40.6mm...

Infineon Technologies AG is releasing support for computer vision in DEEPCRAFT™ Studio, expanding on the existing support for audio, radar...

Infineon Technologies AG announced that its PSOC™ 4 microcontroller (MCU) family now features Multi-Sense capabilities. Infineon expands its leading capacitive...

R&M is expanding the family of SYNO fiber optic splice closures so that telecom companies can compact their infrastructures and...

KYOCERA AVX released the new 9258-100 Series spring-finger board-to-board compression contacts. Designed to provide full connector functionality in a miniature,...

KT successfully demonstrated 5G non-terrestrial network (NTN) technology in a satellite communication environment with long propagation delays. It used a...

STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, has introduced the Teseo VI family of global...

Taipei, Taiwan – AAEON's UP brand this week confirmed the release of the UP Squared 7100 Edge, its fourth generation...

ROHM has developed 650V GaN HEMTs in the TOLL (TO-LeadLess) package: the GNP2070TD-Z. Featuring a compact design with excellent heat...

New Taipei City, Taiwan – NEXCOM is pleased to announce the FTA 5190 AI-Powered Edge Server, powered by the Intel...