Product News
TI unveiled high-performance isolated power modules
Texas Instruments (TI) unveiled new isolated power modules, helping enable increased power density, efficiency and safety in applications ranging from...
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VIAVI Launched TestCenter D2 1.6T Appliance
VIAVI Solutions has announced the launch of its next-generation TestCenter D2 1.6T Appliance designed to help cloud providers, hyperscalers, neoclouds...
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Posifa Introduces PVC4001-C MEMS Pirani Vacuum Transducer
Posifa Technologies introduced its new PVC4001-C MEMS Pirani vacuum transducer, the latest device in the company's PVC4000 series. Designed for cost-effective OEM...
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FineX. Makes Shielding Clear
Panasonic Industry announces the release of FineX (“FineCross”), a next‑generation transparent conductive film engineered for high‑performance electromagnetic wave shielding in advanced or...
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Milestone Systems and IQSIGHT, formerly Bosch Video Systems, Announced the Global Release of SmartSuite
Milestone Systems and IQSIGHT, previously Bosch Video Systems, strengthen their collaboration with the release of SmartSuite, a consolidated plugin suite...
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Ambient Scientific Announced its partnership with Dimension NXG to Power ‘MAI’
Nuremberg, Germany – Today, on International Women’s Day and at Embedded World, Ambient Scientific has announced its partnership with Dimension NXG...
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ASUS Unveils New-Gen NUC 16 Pro Mini PC
TAIPEI, Taiwan— ASUS today announced NUC 16 Pro Mini PC, a compact Copilot+ PC offering versatile AI-accelerated performance to handle...
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oToBrite Announced Two Plug-and-play GMSL2 Camera Enablement Kits
Hsinchu, Taiwan - oToBrite has announced two plug-and-play GMSL2 camera enablement kits for NVIDIA Jetson Orin Nano and NVIDIA Jetson AGX Orin developer kits. Each kit combines a...
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Fujitsu and BCN Port Innovation Foundation leverage ocean digital twin technology to drive the regeneration of the Port of Barcelona
Kawasaki, Japan and Barcelona, Spain - Fujitsu and BCN Port Innovation Foundation today announced a new agreement between Fujitsu Spain and...
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TANAKA Establishes Transfer Technology for its Sintered Gold (Au) Bonding Technology “AuRoFUSE(TM) Preforms”
TOKYO - TANAKA PRECIOUS METAL TECHNOLOGIES Co., Ltd. (Head office: Chuo-ku, Tokyo; Representative Director & CEO: Koichiro Tanaka), a company engaged...
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Electronics Era, India's no.1 growing B2B news forum on Electronics and Cutting Edge Technology is exploring the editorial opportunity for organizations working in the Electronics Manufacturing Services(EMS) Industry.
