Product News
![ALIF Ensemble [E1C]](https://electronicsera.in/wp-content/uploads/2024/06/1-15-350x250.png)
Alif Semiconductor Expands their Groundbreaking Ensemble family with E1C
The new E1C microcontroller with on-chip NPU and large tightly coupled memory opens up new potential for machine learning in...
Read more
Omron Electronic Components Europe has Launched a new High-Capacity DC Relay
Hoofddorp, The Netherlands - Omron Electronic Components Europe has launched a new high-capacity DC relay for use in high-capacity household...
Read more
Uno Minda Introduces a New Range of Cabin Air Filters in the Indian Aftermarket
India - Air pollution continues to pose significant health risks, especially in metro, Tier 1, and Tier 2 cities. The...
Read more
SARVAM UCS, Unified Communication Solution For Modern Enterprises
Matrix SARVAM UCS is an enterprise-grade (SME and ENT) Unified Communication solution that offers Collaboration, Communication, Messaging, and Mobility. It...
Read more
u-blox Empowers Global Connectivity with New Ultra-Compact LTE Cat 1bis Cellular Modules
The LEXI-R10 series, the world’s smallest LTE Cat 1bis module, now includes a global variant for worldwide connectivity. The new...
Read more
CML Launches Ka-band GaN Power Amplifier
Maldon, Essex, UK – CML Micro has announced the launch of a Ka-band gallium nitride (GaN) power amplifier that represents a...
Read more
AAEON Introduces 13th Gen Intel Core Processing to the COM Express Type 10 Form Factor
Taipei, Taiwan – AAEON, a leading provider of Computer-on-Modules, has today announced the NanoCOM-RAP, a COM Express Type 10 CPU...
Read more
OMNIVISION Announces Ultra Small Camera Module for 3D Intraoral Dental Scanners
SANTA CLARA, Calif. – OMNIVISION, a leading global developer of semiconductor solutions, including advanced digital imaging, analog, and touch & display technology, today announced...
Read more
EL-QD Displays – IDTechEx Explores Quantum Dots
The use of quantum dots in displays has made it to high-quality prototypes amongst established tech companies like Samsung, Sharp,...
Read more
Unlocking Ultra-Wideband: Yole Group Analyzes NXP’s, Qorvo’s, and Apple’s Technical Choices
OUTLINE Between NXP, Apple, and Qorvo, technical choices and packaging types vary significantly: WLCSP, FCPGA Package, and SiP. One module...
Read more
Electronics Era, India's no.1 growing B2B news forum on Electronics and Cutting Edge Technology is exploring the editorial opportunity for organizations working in the Electronics Manufacturing Services(EMS) Industry.
