Norrköping, Sweden – Ligna Energy, manufacturer of ultra-thin supercapacitors for wireless electronics, announces its attendance at Embedded World 2026 in...
Read moreCHANDLER, Ariz.—Everspin Technologies, Inc. has announced the UNISYST MRAM family, a new generation of unified memory designed to fundamentally change how embedded...
Read moreIn collaboration with NXP, Gateworks is releasing a new M.2 AI Acceleration Card, the GW16168, with NXP’s passively cooled Discrete...
Read moreNuremberg, Germany – GigaDevice, a leading semiconductor company specializing in Flash memory, 32-bit microcontrollers (MCUs), sensors, and analog products, today announced its participation at Embedded...
Read moreMunich, Germany, and Tokyo, Japan – 9 March 2026 – Infineon Technologies AG and Subaru Corporation are collaborating to enhance...
Read moreShenzhen, China - March 4, 2026 - MYIR has launched the MYC-YM62LX System-on-Module (SoM) based on the Texas Instruments AM62Lx...
Read moreGmunden – New Discrete DC/DC Converter Components Available Now. RECOM is launching a new range of Power ICs and SMD...
Read moreIndia’s urban consumption story is being rewritten at remarkable speed. The surge of quick commerce, food delivery, and hyperlocal parcel...
Read moreNational: Microchip Technology today announces the LX4580, a 24‑channel mixed‑signal IC designed to streamline high‑reliability actuation control systems for aviation and defense applications. The...
Read moreCHANDLER, Ariz. — Everspin Technologies, Inc. has announced continued progress across its high-reliability (HR) PERSYST xSPI STT-MRAM portfolio, including the completion of...
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