TOKYO, Japan ― Renesas Electronics Corporation has announced that its automotive Cyber Security Management System (CSMS) used for the development of...
Read moreTOKYO, Japan― Renesas Electronics Corporation has announced a complete space-ready reference design for the AMD Versal™ adaptive system-on-chip (SoC) XQRVC1902. Developed...
Read moreQualcomm Technologies, Inc. and Meta are working to optimize the execution of Meta’s Llama 2 large language models directly on-device...
Read moreSCOTTSDALE, Ariz. and AUBURN HILLS, Mich. – onsemi has announced the two companies are expanding their strategic collaboration for silicon...
Read moreMunich, Germany– Infineon Technologies AG introduces a 62mm half-bridge and common emitter module portfolio with 1200 V TRENCHSTOP™ IGBT7 chips....
Read moreBordeaux, France- 60W-rated PCB front-end module (also known as input bus conditioner) allows compliance with the most stringent military specifications...
Read moreClacton-on-Sea, UK: Pickering Electronics has launched a new high temperature high voltage single-in-line reed relay that can operate at up...
Read moreThalwil, Switzerland – u-blox has announced the u-bloxLEXI-R4, its newest module customized for size-constrained application requirements. Albeit compact (16 x 16 mm), the module...
Read moreSTMicroelectronics has begun volume production of e-mode PowerGaN HEMT (high-electron-mobility transistor) devices that simplify the design of high-efficiency power-conversion systems. The STPOWER™...
Read moreMunich, Germany – The evolving market for automotive event data recorders (EDR) is driving demand for specialized data-logging memory devices...
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