Semiconductor
ST40V STripFET F8 MOSFETs save energy and lower noise
Cutting both on-resistance and switching loss, while optimizing body-diode properties, the STMicroelectronics 40V MOSFETs, STL320N4LF8 and STL325N4LF8AG, save energy and ensure low noise...
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Sony and Honda Establish New Company, “Sony Honda Mobility Inc.”
TOKYO- Sony Group Corporation ("Sony") and Honda Motor Co., Ltd. ("Honda") has announced that they have signed a joint venture agreement...
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Vishay Introduced Three New Series of 24 V Surface-Mount XClampR TVS
MALVERN, Pa.— Vishay Intertechnology has introduced three new series of 24 V surface-mount XClampR transient voltage suppressors (TVS) that offer...
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RECOM’s new RPX-0.5Q and RPX-1.5Q DC/DCs qualified to AEC-Q100 Grade 1
RECOM’s new RPX-0.5Q and RPX-1.5Q are qualified to AEC-Q100 Grade 1 requirements, opening up more options for automotive applications as...
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R&S Highlights ADAS test solutions at Automotive Testing Expo Europe 2022
Comprehensive automotive testing is crucial for chipset developers, ECU suppliers, vehicle manufacturers and certification bodies to ensure faultless performance, particularly...
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Renesas Develope Circuit Technologies for 22-nm Embedded STT-MRAM
TOKYO, Japan ― Renesas Electronics Corporation has announced that it has developed circuit technologies for an embedded spin-transfer torque magnetoresistive random-access...
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Renesas Launched two New Cloud Development Kits, CK-RA6M5 and CK-RX65N
TOKYO, Japan ― Renesas Electronics Corporation has announced two new cloud development kits, CK-RA6M5 and CK-RX65N, providing a complete connectivity solution...
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Flex Announced BMR473 digital Point of Load converter packaged
in a space-saving SIP
SIP or horizontal mount formatInput 6 – 15 VOutput 0.6 – 5 VParallelable up to four unitsPMBus® Flex Power Modules...
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Infineon Unveiled ISO26262-compliant 3D image sensor for automotive
Munich– Innovative car cockpits, seamless connectivity with new services and improved passive safety: 3D depth sensors play a key role...
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Infineon adds AIROC CYW20820 Bluetooth & Bluetooth LE SoC to its AIROC Bluetooth Portfolio
Munich, Germany – Infineon Technologies AG is adding the AIROC CYW20820 Bluetooth & Bluetooth LE (low energy) system on chip...
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Electronics Era, India's no.1 growing B2B news forum on Electronics and Cutting Edge Technology is exploring the editorial opportunity for organizations working in the Electronics Manufacturing Services(EMS) Industry.
