congatec announces the availability of COM-HPC and COM Express Computer-on-Modules based on high-end 13th Gen Intel Core processors in BGA...
Read moreMikroElektronika (MIKROE) has announced a new open standard – DISCON – that defines both display socket and display board, facilitating...
Read morecongatec – a leading vendor of embedded and edge computing technology – welcomes the ratification of the COM Express 3.1...
Read moreAAEON has launched the NanoCOM-EHL, a COM Express Type 10 CPU Module, to its multiplatform range of products powered by...
Read moreIn order to open up new markets and applications for scalable standard modules, Avnet Embedded, the leading manufacturer of embedded...
Read morecongatec – a leading vendor of embedded and edge computing technology – introduces its new ecosystem for TSN aimed at...
Read moreAfter much anticipation, leading edge AI solutions provider AAEON has announced the release of the BOXER-8641AI, its first Compact Fanless...
Read moreWAKEFIELD, MA.,- PICMG announces that the new COM Express 3.1 specification has been ratified to support high-speed serial interfaces such...
Read moreMikroElektronika has launched a new SiBRAIN add-on board, SiBRAIN for GD32VF103VBT6, enabling embedded designers to start prototyping with the GigaDevice...
Read moreTaipei, Taiwan – In a major breakthrough in single board computing, AAEON introduces the de next-TGU8, the smallest board featuring...
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