AAEON, a leading Computer-on-Modules developer, has added the COM-ICDB7, powered by the 3rd Generation Intel Xeon D Processor platform (formerly...
Read moreIntuitive Machines and Japan-based robotics company, Dymon Co. have signed an agreement to fly Dymon’s Yaoki rover on Intuitive Machines’...
Read moreTDK Corporation nnounced the TDK i3 Micro Module, the world’s first module with built-in edge AI and wireless mesh connectivity...
Read moreams OSRAM extended its Mira family of pipelined, high- sensitivity, global shutter CMOS image sensors with the launch of the...
Read moreEveryone gets itWhy am I here? Ho Ho Ho! Welcome back to the Bug Report, or a more fitting name...
Read moreAt CES 2023, Qualcomm Technologies, Inc. announced Snapdragon Satellite — the world’s first satellite-based two-way capable messaging solution for premium...
Read moreQuadric and ams OSRAM has announced a strategic collaboration to develop integrated sensing modules combining ams OSRAM’s leading edge Mira...
Read moreMouser Electronics is now stocking the AS7343L 13-channel multi-spectral sensor from ams OSRAM. This compact sensor combines multi-channel color analysis...
Read moreEnergy Efficiency Services Limited (EESL), a joint venture of Public Sector Undertakings under the administration of Ministry of Power is...
Read moreTDK Corporation expands its compact and low-power InvenSense SmartIndustrialâ„¢ sensor platform family. With its support for extended temperature range of...
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