TECH ROOM

Infineon Technologies AG recently added EasyPACK™ 4B to its industry-leading Easy power module family. The lead-type of the new family...

Vishay Intertechnology, Inc. has introduced the industry’s first AEC-Q102 qualified linear optocoupler. Offering industry-high isolation voltage of 5300 Vrms, the...

“Following major strategic partnerships concluded early this year, the race was on to implement them on the ground. We’re pleased...

The EUTELSAT 10B communications satellite, built by Thales Alenia Space, a joint venture between Thales (67%) and Leonardo (33%), has...

Diodes Incorporated (Diodes) is introducing its latest PCIe® 3.0 packet switch, the DIODES™ PI7C9X3G1224GP. A high-performance 12-port, 24-lane device, it...

Mumbai, India : Authorized Push Payment (APP) fraud losses are expected to climb to $612 million in India by 2026...

SEMICON Korea 2023, the region’s premier microelectronics event, will gather industry experts and visionaries February 1-3 at COEX in Seoul...

AAEON has launched the NanoCOM-EHL, a COM Express Type 10 CPU Module, to its multiplatform range of products powered by...

Figure 1 Global eyes are soon to be turned to the first global football tournament to be held in the...

Renesas Electronics Corporation, has announced that hundreds of its radiation-hardened (rad-hard) integrated circuits (ICs), including over 50 different part numbers,...