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Home News Product News

SHENMAO Launched Anti-HoP Lead-Free Solder Paste

New Anti-HoP Lead-Free Solder Paste Developed to Prevent HoP Issues

Editorial by Editorial
March 14, 2023
in Product News, SMT/PCB/EMS
Reading Time: 1 min read
SHENMAO
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SHENMAO America has released its new Anti-HoP Lead-Free Solder Paste PF606-P130N. The paste is specially designed for the SMT process to prevent head-on-pillow (HoP) issues.

The demand for ultra-thin packages has increased, thus the reduction in package thickness has caused increased warpage. The warpage during the reflow process increases the gap between BGA components and solder paste, leading to HoP issues and production yield loss.

PF606-P130N features great flux activity that can prevent oxidation of solder powder during the reflow process. Furthermore, the new paste shows excellent solderability and hot slump performance to cover the warpage of components and prevent BGA/CSP HoP issues.

PF606-P130N is designed for the SMT process, especially for thin BGA package components. For more information, please visit www.shenmao.com.

Tags: Anti-HoPLead-FreePF606-P130NSHENMAOSMTSolder Paste
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