Electronics Era

  • About Us
  • Advertise with Us
  • Contact Us
  • e-Mag
  • Webinars
Header logo on website
Advertisement
Advertisement
Menu
  • News
    • Industry News
    • Product News
  • TECH ROOM
    • Sensor
    • VR / AR
    • Embedded
    • Medical Electronics
    • Industry 4.0
    • Robotic
    • Automation
    • Smart Machine
    • Component
    • Manufacturing
    • Aerospace & Defence
    • Security
    • Policy
  • Semiconductor
    • AUTOMOTIVE ELECTRONICS
      • EVs
      • HEVs
      • ADAS
      • Connected Cars
    • IoT-Internet of Things
      • Development Kit
      • IoT Design
    • Power Electronics
      • AC-DC/DC-DC Converters
      • Mosfets
      • IGBTs
      • LEDs
  • T & M
    • 5G testing
    • Oscilloscopes
    • SDN & NFV
    • RF & Wireless
  • AI/ML
  • Telecom
    • 5G/6G
  • RENEWABLES
    • Sustainability
  • Future Tech
    • Data Center
    • Cloud Computing
    • Big Data Analytics
  • Webinars
  • Editor’s Pick
    • Tech Article
    • Tech Blog
    • White Papers
    • EE-Tech Talk
    • Market Research
  • EE Awards
    • EE Awards 2025
    • EE Awards 2024
  • MORE
    • E-Mag
    • Events
    • Subscription
    • Contact Us
Home Semiconductor Power Electronics

Flex Power announce 700 W digital quarter brick for RFPA applications

Flex Power Modules to announce new 700 W digital quarter brick for RFPA applications at embedded world 2023

Editorial by Editorial
March 14, 2023
in Power Electronics, Product News
Reading Time: 2 mins read
FLEXR075
Share on FacebookShare on TwitterShare on LinkedIn

Flex Power Modules will be showing their new 700 W digital quarter brick DC/DC converter at embedded world 2023 in Nuremburg, Germany, March 14-16.

The through-hole mounted BMR684 is targeted at RFPA applications needing a 50 V supply at up to 14 A for gallium nitride (GaN) or laterally diffused MOSFET (LDMOS) power amplifiers, and a wide adjustment range of 25-55V is offered to help system designers achieve the optimum efficiency and linearity of the power amplifier.  

The device achieves an impressive 96% efficiency at full load, and has a maximum baseplate operating temperature of 100°C. The converter input range is 36-75 VDC and a remote control function is included, along with remote sense. Input-output isolation is 1500 VDC, and the device is packaged in the industry-standard quarter brick format measuring 58.4 x 36.8 x 12.7 mm (2.3 x 1.45 x 0.5 in).

The product is fully protected against input under-voltage, over-temperature, output over-voltage, over-current and short circuits. As with all Flex Power Modules’ DC/DC converters, these units comply with IEC/EN/UL 62368-1 safety standards.

The BMR684 includes a PMBusTM interface to allow easy monitoring of input and output voltages, output current, and device temperature. The device also allows users to configure many aspects of the device operation including voltage and current for improved fault tolerance, and optimization of the module’s control loop for stable operation in a wide range of circumstances. Power management features also include configurable soft start/stop, precision delay, and ramp-up, and the product is fully supported by the powerful Flex Power Designer tool.

Olle Hellgren, Director Product Management and Marketing at Flex Power Modules, said: “Customers in the RFPA field are constantly looking for higher power density solutions for GaN and LDMOS based Radio Unit designs, and the new BMR684 delivers the power levels that traditionally have only been delivered in half brick packages, and with the added benefit of the PMBus interface, we believe this is a winning combination.”

Flex Power Modules will be contributing to the embedded world Power Supply Conference, with a presentation entitled ‘Peak Load Management by Communication with DC/DC Converters’ on Tuesday 14th March at 11.30am.  The presenter is Giorgio Mauri, Senior Principal Field Applications Engineer at Flex Power Modules.The new BMR684 as well as the whole product portfolio will be on display at the Flex Power Modules booth in hall 4 number 561.

Tags: DC/DC converterdigital quarter brickEmbedded World 2023Flex Power Modules
Editorial

Editorial

Join Our Newsletter

* indicates required
Electronics Era

Electronics Era, India's no.1 growing B2B news forum on Electronics and Cutting Edge Technology is exploring the editorial opportunity for organizations working in the Electronics Manufacturing Services(EMS) Industry.

Follow Us

Browse by Category

  • 5G testing
  • 5G/6G
  • AC-DC/DC-DC Converters
  • ADAS
  • Aerospace & Defence
  • AI/ML
  • Automation
  • AUTOMOTIVE ELECTRONICS
  • Big Data Analytics
  • Blockchain
  • Cloud Computing
  • Component
  • Connected Cars
  • Data Center
  • Editor's Desk
  • EE-Tech Talk
  • Electronics Components
  • Embedded
  • EVs
  • Future Tech
  • HEVs
  • Industry 4.0
  • Industry News
  • IoT-Internet of Things
  • LED & Lighting
  • LEDs
  • Manufacturing
  • Market Research
  • Medical Electronics
  • Mosfets
  • News
  • Oscilloscopes
  • Policy
  • Power Electronics
  • Product News
  • RENEWABLES
  • RF & Wireless
  • Robotic
  • SDN & NFV
  • Security
  • Semiconductor
  • Sensor
  • Smart Machine
  • SMT/PCB/EMS
  • Sustainability
  • T & M
  • Tech Article
  • Tech Blog
  • TECH ROOM
  • Telecom
  • Uncategorized
  • VR / AR
  • White Papers

Recent News

Allied Market Research

Software Defined Vehicles: Future of Mobility and Transportation

May 31, 2025
Solitaire

Solitaire Launches PTK-208 PTZ Camera to Elevate Video Conferencing

May 31, 2025
  • About Us
  • Advertise with Us
  • Contact Us

© 2022-23 TechZone Print Media | All Rights Reserved

No Result
View All Result
  • News
    • Industry News
    • Product News
  • TECH ROOM
    • Sensor
    • VR / AR
    • Embedded
    • Medical Electronics
    • Industry 4.0
    • Robotic
    • Automation
    • Smart Machine
    • Component
    • Manufacturing
    • Aerospace & Defence
    • Security
    • Policy
  • Semiconductor
    • AUTOMOTIVE ELECTRONICS
      • EVs
      • HEVs
      • ADAS
      • Connected Cars
    • IoT-Internet of Things
      • Development Kit
      • IoT Design
    • Power Electronics
      • AC-DC/DC-DC Converters
      • Mosfets
      • IGBTs
      • LEDs
  • T & M
    • 5G testing
    • Oscilloscopes
    • SDN & NFV
    • RF & Wireless
  • AI/ML
  • Telecom
    • 5G/6G
  • RENEWABLES
    • Sustainability
  • Future Tech
    • Data Center
    • Cloud Computing
    • Big Data Analytics
  • Webinars
  • Editor’s Pick
    • Tech Article
    • Tech Blog
    • White Papers
    • EE-Tech Talk
    • Market Research
  • EE Awards
    • EE Awards 2025
    • EE Awards 2024
  • MORE
    • E-Mag
    • Events
    • Subscription
    • Contact Us

© 2022-23 TechZone Print Media | All Rights Reserved

Advertisement
Advertisement