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Home News Industry News

Huawei Mate 60 Pro: what about the HiSilicon 9000s SoC?

Discover all the technology ins and outs of the HiSilicon 9000s SoC in the Huawei Mate 60 Pro.

Nimish by Nimish
March 12, 2024
in Industry News, Semiconductor
Reading Time: 2 mins read
Huawei Mate 60 Pro

Huawei Mate 60 Pro

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LYON, France -HiSilicon, a fabless IC design company owned by Huawei, creates semiconductor chips for Huawei to support a wide range of smart devices, reports Yole Group. The Kirin series is the flagship model for high-end smartphones.

In 2020, HiSilicon unveiled the Kirin 9000 to power the Huawei Mate 40 Series. This chip was manufactured using TSMC’s 5nm technology. In 2023, Huawei introduced the Mate 60 Pro smartphone, featuring HiSilicon’s newborn SoC, the Kirin 9000s, as the main processor. The chip itself has the following dimensions: 14.5 x 14.3 x 0.4 mm3, with a 207 mm2 area and 0.35 µm ball pitch. It includes the HiSilicon Kirin 9000s SoC die package and DRAM package…

What’s inside?

Yole Group releases today the technology, process & cost analysis/report, HiSilicon Kirin 9000s SoC in Huawei Mate 60 Pro. This analysis provides significant insights into the technical choices made by HiSilicon and the company behind it, the leading smartphone manufacturer, Huawei. This new report also delivers an insightful analysis of the manufacturing cost and selling price.

Based on a complete Huawei Mate 60 Pro teardown available in Yole Group’s Consumer Teardown Tracks, Phone module, the HiSilicon Kirin 9000s SoC report reveals multiple details surrounding the processor and the integration of the LPDDR5 DRAM package atop the SoC die package on the main board. Indeed, it gives numerous analyses ranging from the SoC die FEOL and back-end construction to the assembly. With this new report, Yole Group’s analysts aim to provide an understanding of the technical breakthroughs and related manufacturing processes offered by the Chinese company HiSilicon.

This new report highlights the top view and cross-section of the SoC using optical microscopy, CT-scan, SEM, and EDS to analyze the structure and materials. It also presents a complete analysis of SMIC’s N+2 FinFET using TEM.

This report also offers a detailed comparative analysis of the Kirin 9000 and Kirin 9000s, encompassing packaging to SoC die characteristics and furnishes a complete cost analysis…

To read the full story, please click: Huawei Mate 60 Pro: what about the HiSilicon 9000s SoC?

Tags: HiSilicon 9000sHuaweiSoC
Nimish

Nimish

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