LYON, France – Through networking applications and especially AI and ML systems, CPO leads the way, announces Yole Intelligence, part of Yole Group. AI models have an insatiable demand for compute, storage, and data movement, and the capabilities of traditional architectures will become the main bottleneck for scaling ML. As a result, new optical interconnects have emerged for HPC and its new disaggregated architecture. Industry calls it in-package optical I/O technology. In-package optical I/O technology for xPUs, memory, and storage can help achieve the necessary bandwidths. The basic idea is to bring optics to very short reach transmission distances, such as intra-rack applications or within a system.
In its new report, Co-packaged Optics for Datacenter 2023, Yole Intelligence investigates CPO technology. Analysts provide detailed forecasts of the market split by technology architecture and review the industry in detail, including its supply chain. The technological approaches and current challenges are also well described. In addition, this study examines the global challenges and focuses on the power and energy aspects.
According to Martin Vallo, Ph.D., Senior Analyst, Photonics, specializing in optical communication and semiconductor lasers within the Photonics and Sensing division at Yole Intelligence: “Currently, many challenges stem from using electrical I/Os. Applications such as AI/ML frequently need to move data rapidly from one chip to another or one board to another. Consequently, the computing chips need more communication, either through a larger number of pads or very high speed in a single pad. Additionally, data movement power is the primary driver of power increases in server chips”…
To read the full story, please click: In-package optical I/O, a key enabler for Artificial Intelligence & Machine Learning,
For more information Yole Group
