Munich, Germany – Infineon Technologies AG is adding the AIROC CYW20820 Bluetooth & Bluetooth LE (low energy) system on chip (SoC) to its AIROC Bluetooth Portfolio. The AIROC CYW20820 Bluetooth & Bluetooth LE SoC is a Bluetooth 5.2 core spec compliant device tailor made for IoT applications. It is designed to support a wide spectrum of use cases for home automation and sensors including medical, home, security, and industrial, as well as lighting, Bluetooth Mesh, or any IoT application that needs Bluetooth LE or dual mode Bluetooth connectivity.
The AIROC CYW20820 Bluetooth & Bluetooth LE SoC provides reliable connectivity and low power with high performance compute capability integrating an ARM® Cortex®-M4 microcontroller unit with floating point unit. It is a highly integrated device with multiple digital interfaces, optimized memory subsystem, and power amplifier delivering up to 11.5 dBm transmit output power in LE and BR (basic rate) modes, reducing the device footprint and the costs associated with implementing Bluetooth solutions.
Infineon is also adding to its extensive AIROC Bluetooth module portfolio with three modules that include onboard crystal oscillator, passive components, and the AIROC CYW20820 system on chip. These highly integrated modules are globally certified to support fast time-to-market of IoT devices. The AIROC CYBT-243053-02, CYBT-253059-02, and CYBT-243068-02 modules are supported by ModusToolbox software and tools with code examples to support rapid development of Bluetooth applications.
“The AIROC CYW20820 Bluetooth, Bluetooth LE SoC and modules are key additions to our portfolio and provide a solution that is low-power, cost-efficient and with scalable performance. With certified AIROC modules, Infineon is taking care of key steps in Bluetooth design to enable customers to have the quickest path to market.” said Sonal Chandrasekharan, Vice President of the Bluetooth product line at Infineon.
More information is available at www.infineon.com/wireless.
