Electronics Era

  • About Us
  • Advertise with Us
  • Contact Us
  • e-Mag
  • Webinars
Header logo on website
Advertisement
Advertisement
Menu
  • News
    • Industry News
    • Product News
  • TECH ROOM
    • Sensor
    • VR / AR
    • Embedded
    • Medical Electronics
    • Industry 4.0
    • Robotic
    • Automation
    • Smart Machine
    • Component
    • Manufacturing
    • Aerospace & Defence
    • Security
    • Policy
  • Semiconductor
    • AUTOMOTIVE ELECTRONICS
      • EVs
      • HEVs
      • ADAS
      • Connected Cars
    • IoT-Internet of Things
      • Development Kit
      • IoT Design
    • Power Electronics
      • AC-DC/DC-DC Converters
      • Mosfets
      • IGBTs
      • LEDs
  • T & M
    • 5G testing
    • Oscilloscopes
    • SDN & NFV
    • RF & Wireless
  • AI/ML
  • Telecom
    • 5G/6G
  • RENEWABLES
    • Sustainability
  • Future Tech
    • Data Center
    • Cloud Computing
    • Big Data Analytics
  • Webinars
  • Editor’s Pick
    • Tech Article
    • Tech Blog
    • White Papers
    • EE-Tech Talk
    • Market Research
  • EE Awards
    • EE Awards 2025
    • EE Awards 2024
  • MORE
    • E-Mag
    • Events
    • Subscription
    • Contact Us
Home News Product News

Infineon Introduced Two New Solutions: SECORA ID V2 and the eID-OS

Infineon expands government ID portfolio with SECORA™ ID V2 and eID-OS for enhanced flexibility and faster time-to-market

Editorial by Editorial
June 16, 2025
in Product News, Semiconductor
Reading Time: 3 mins read
INFIN_eID-OS
Share on FacebookShare on TwitterShare on LinkedIn

Munich, Germany – Electronic identification (eID) documents are seeing growing demand worldwide as governments push ahead with their digitalization efforts. To meet these rapidly evolving requirements more quickly and flexibly, Infineon Technologies AG has introduced two new solutions: SECORA™ ID V2 and the eID-OS. These solutions offer local security printers and card manufacturers greater flexibility in selecting the right solution for their specific project requirements, while helping to reduce development time and accelerate deployment.

“Our broad range of solutions is a clear commitment to our customers and their individual, local requirements in the field of ID projects,” says Maurizio Skerlj, Senior Vice President and Product Line Manager for Authentication and Identity Solutions at Infineon Connected Secure Systems. “With our all-in-one solutions, including innovative packaging options such as our coil-on-module technology and our antenna design support, we enable our customers to get their products to market faster, develop a flexible solution to their specific requirements, and realize new applications.”

SECORA ID V2: improved security features and faster transaction speeds

SECORA ID V2 is the successor to the SECORA ID V1 Java Card® solution for electronic ID and authentication applications in the public sector. The V2 version of SECORA ID increases transaction speed by up to 80 percent compared to its predecessor. It is based on a 40 nm hardware architecture and can transfer data at speeds of up to 6.8 MBit/s. This enables faster personalization and processing of ID documents and allows for quick and smooth identity checks at borders and security checkpoints. SECORA ID V2 is based on the latest Java Card 3.1 standard and supports biometric match-on-card functions to increase user data protection. Customers benefit from Infineon’s broad applet toolset. It also supports payment tools such as Visa®, Mastercard®, and Calypso® as well as the crypto vision ePasslet Suite. This wide range of applets enables developers to easily integrate and quickly deploy highly customized ID solutions. Furthermore, the sandbox enables the integration of native code without compromising security standards. The SECORA ID V2 platform is Common Criteria EAL6+(high) certified and EMVCo approved.

Infineon eID-OS: Ready-to-use and low operating expenses

Infineon eID-OS is the latest addition to the portfolio of native solutions, combining the latest TEGRION™ security controller with a native operating system. Designed for basic ID application projects, it offers a performance- and cost-optimized solution with fast time-to-market. The standards-compliant solution is targeting CC EAL 5+ eMRTD (Common Criteria Evaluation Assurance Level for electronic Machine Readable Travel Document)certification and is housed in advanced packaging technology. It optimizes the development process, enables rapid deployment, and reduces maintenance costs. Featuring a powerful 32-bit CPU, advanced cryptography accelerators, and the robust Integrity Guard 32 security architecture, eID-OS enables fast and secured transactions with processing times of less than 0.5 seconds. Thanks to simplified implementation, personalization, and administration, as well as a secured chain of trust and automatic data size detection, customers benefit from low total cost of ownership. In addition, Infineon’s ultra-thin contactless coil-on-module package supports thinner electronic data pages, reducing document costs and the carbon footprint. The space saved can alternatively be used for an additional security layer, making this solution ideal for modern eID projects.

Availability: More information is available at www.infineon.com/eID-OS and www.infineon.com/SECORA-ID

Tags: eID-OSInfineonSECORA ID V2
Editorial

Editorial

Join Our Newsletter

* indicates required
Electronics Era

Electronics Era, India's no.1 growing B2B news forum on Electronics and Cutting Edge Technology is exploring the editorial opportunity for organizations working in the Electronics Manufacturing Services(EMS) Industry.

Follow Us

Browse by Category

  • 5G testing
  • 5G/6G
  • AC-DC/DC-DC Converters
  • ADAS
  • Aerospace & Defence
  • AI/ML
  • Automation
  • AUTOMOTIVE ELECTRONICS
  • Big Data Analytics
  • Blockchain
  • Cloud Computing
  • Component
  • Connected Cars
  • Data Center
  • Editor's Desk
  • EE-Tech Talk
  • Electronics Components
  • Embedded
  • EVs
  • Future Tech
  • HEVs
  • Industry 4.0
  • Industry News
  • IoT-Internet of Things
  • LED & Lighting
  • LEDs
  • Manufacturing
  • Market Research
  • Medical Electronics
  • Mosfets
  • News
  • Oscilloscopes
  • Policy
  • Power Electronics
  • Product News
  • RENEWABLES
  • RF & Wireless
  • Robotic
  • SDN & NFV
  • Security
  • Semiconductor
  • Sensor
  • Smart Machine
  • SMT/PCB/EMS
  • Sustainability
  • T & M
  • Tech Article
  • Tech Blog
  • TECH ROOM
  • Telecom
  • Uncategorized
  • VR / AR
  • White Papers

Recent News

MIKROE

What’s in your Water? Check with TDS Click from MIKROE

June 16, 2025
Wika India

Sustainability in Electronics Manufacturing: Strategies for a Greener Future

June 16, 2025
  • About Us
  • Advertise with Us
  • Contact Us

© 2022-23 TechZone Print Media | All Rights Reserved

No Result
View All Result
  • News
    • Industry News
    • Product News
  • TECH ROOM
    • Sensor
    • VR / AR
    • Embedded
    • Medical Electronics
    • Industry 4.0
    • Robotic
    • Automation
    • Smart Machine
    • Component
    • Manufacturing
    • Aerospace & Defence
    • Security
    • Policy
  • Semiconductor
    • AUTOMOTIVE ELECTRONICS
      • EVs
      • HEVs
      • ADAS
      • Connected Cars
    • IoT-Internet of Things
      • Development Kit
      • IoT Design
    • Power Electronics
      • AC-DC/DC-DC Converters
      • Mosfets
      • IGBTs
      • LEDs
  • T & M
    • 5G testing
    • Oscilloscopes
    • SDN & NFV
    • RF & Wireless
  • AI/ML
  • Telecom
    • 5G/6G
  • RENEWABLES
    • Sustainability
  • Future Tech
    • Data Center
    • Cloud Computing
    • Big Data Analytics
  • Webinars
  • Editor’s Pick
    • Tech Article
    • Tech Blog
    • White Papers
    • EE-Tech Talk
    • Market Research
  • EE Awards
    • EE Awards 2025
    • EE Awards 2024
  • MORE
    • E-Mag
    • Events
    • Subscription
    • Contact Us

© 2022-23 TechZone Print Media | All Rights Reserved

Advertisement
Advertisement