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Home Semiconductor Power Electronics Mosfets

Infineon Introduces New CoolSET System in Package (SiP) in a Compact Design

Editorial by Editorial
May 2, 2025
in Mosfets, Power Electronics, Semiconductor
Reading Time: 2 mins read
CoolSET SiP
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Munich, Germany – Infineon Technologies AG is launching its new CoolSET™ System in Package (SiP), a compact, fully integrated system power controller for highly efficient power delivery of up to 60 W at universal input voltage range of 85 – 305 VAC. Housed in a small SMD package, the high-voltage MOSFET with low RDS(ON) eliminates the need for an external heat sink, reducing system size and complexity. The CoolSET SiP supports zero-voltage switching (ZVS) flyback operation, which enables low switching losses and low EMI signature, while also enhancing system reliability and robustness. This makes it an ideal solution for applications such as major home appliances and AI servers. In addition, the controller makes it easier for developers to meet stringent energy standards, supporting future-proof power solutions for modern designs.

The CoolSET SiP integrates a 950 V startup-cell, an 800 V avalanche rugged CoolMOS™ P7 SJ MOSFET, a ZVS primary flyback controller, a secondary-side synchronous rectification (SR) controller, and reinforced isolated communication enabled by Infineon’s proprietary CT Link technology. This high level of integration supports the development of more sophisticated end products by significantly reducing the number of discrete components, lowering the bill of materials, and minimizing PCB space requirements. A comprehensive set of advanced protection features simplifies system integration and allows designers more flexibility to optimize their solutions and enhance the overall user experience.

Availability
Infineon’s CoolSET System in Package (SiP) product samples are available to order. Infineon will show a demo version at PCIM Europe 2025. Further information is available at https://www.infineon.com/cms/en/product/promopages/coolset-sip/

Infineon at the PCIM Europe 2025
PCIM Europe will take place in Nuremberg, Germany, from 6 to 8 May 2025. Infineon will present its products and solutions for decarbonization and digitalization in hall 7, booth #470. Company representatives will also be giving several presentations at the PCIM Expo stages and the accompanying PCIM Conference, followed by discussions with the speakers. If you are interested in interviewing an expert at the show, please email media.relations@infineon.com. Industry analysts interested in a briefing can email MarketResearch.Relations@infineon.com. Information about Infineon’s PCIM 2025 show highlights is available at www.infineon.com/pcim.

Tags: CoolSETInfineonMOSFET
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