Electronics Era

  • About Us
  • Advertise with Us
  • Contact Us
  • e-Mag
  • Webinars
Header logo on website
Advertisement
Advertisement
Menu
  • News
    • Industry News
    • Product News
  • TECH ROOM
    • Sensor
    • VR / AR
    • Embedded
    • Medical Electronics
    • Industry 4.0
    • Robotic
    • Automation
    • Smart Machine
    • Component
    • Manufacturing
    • Aerospace & Defence
    • Security
    • Policy
  • Semiconductor
    • AUTOMOTIVE ELECTRONICS
      • EVs
      • HEVs
      • ADAS
      • Connected Cars
    • IoT-Internet of Things
      • Development Kit
      • IoT Design
    • Power Electronics
      • AC-DC/DC-DC Converters
      • Mosfets
      • IGBTs
      • LEDs
  • T & M
    • 5G testing
    • Oscilloscopes
    • SDN & NFV
    • RF & Wireless
  • AI/ML
  • Telecom
    • 5G/6G
  • RENEWABLES
    • Sustainability
  • Future Tech
    • Data Center
    • Cloud Computing
    • Big Data Analytics
  • Webinars
  • Editor’s Pick
    • Tech Article
    • Tech Blog
    • White Papers
    • EE-Tech Talk
    • Market Research
  • EE Awards
    • EE Awards 2025
    • EE Awards 2024
  • MORE
    • E-Mag
    • Events
    • Subscription
    • Contact Us
Home Semiconductor AUTOMOTIVE ELECTRONICS

Infineon’s HYPERRAM 3.0 Memory and Autotalks’ Chipset Drive Next-Generation Automotive V2X Applications

Editorial by Editorial
June 7, 2023
in AUTOMOTIVE ELECTRONICS, Semiconductor
Reading Time: 2 mins read
HYPERRAM 3.0
Share on FacebookShare on TwitterShare on LinkedIn

Munich, Germany – Infineon Technologies AG and Autotalks has announced that the two companies are collaborating to deliver solutions for next-generation V2X (Vehicle-to-Everything communication) applications. In this collaboration, Infineon provides its automotive-grade HYPERRAM™ 3.0 memory to support Autotalks’ TEKTON3 and SECTON3 V2X reference designs.

TEKTON3 is a fully-integrated V2X system-on-chip (SoC) specifically designed for driving actions by connectivity. V2X enables vehicles to communicate with one another and their environment, ultimately leading to improved road safety. Concurrent dual-radio and full V2X software implementations typically require external memory to manage modem and application requirements. HYPERRAM is the memory-of-choice that meets the cost, density and performance requirements for external memories.

With HYPERRAM 3.0, Infineon extends the throughput of its HYPERRAM family to achieve 800 MBps (mega bytes per second) via a x16 HYPERBUS interface. HYPERRAM 3.0 devices are automotive qualified and are the ideal expansion memory solution to complement TEKTON3’s processing needs.

“Infineon’s HYPERRAM and NOR flash memories are ideal pairings for our latest generation of V2X SoCs,” said Amos Freund, Autotalks’ Vice President R&D. “We are excited to team with Infineon, a memory and automotive leader, in order to realize our cutting-edge V2X offering, enabling OEMs to create targeted V2X solutions.”

“With the global V2X market expected to grow at a CAGR over 30 percent in the next five years, this collaboration with Autotalks comes at an ideal time,” said Patrick Le Bihan, Senior Director of Ecosystem Marketing at Infineon. “Our HYPERRAM and NOR Flash memories work seamlessly with Autotalks’ SoCs to deliver a low-cost, high-performance solution to customers in an energy-efficient manner. We are excited to team with a leading provider of V2X devices and look forward to an ongoing collaboration with Autotalks.”

Availability Infineon’s HYPERRAM 3.0 products are available. More information about the complete solution is available at www.infineon.com/HYPERRAM

Tags: AutomotiveAutotalksHYPERRAM 3.0 memoryInfineon TechnologiesV2X applications
Editorial

Editorial

Join Our Newsletter

* indicates required
Electronics Era

Electronics Era, India's no.1 growing B2B news forum on Electronics and Cutting Edge Technology is exploring the editorial opportunity for organizations working in the Electronics Manufacturing Services(EMS) Industry.

Follow Us

Browse by Category

  • 5G testing
  • 5G/6G
  • AC-DC/DC-DC Converters
  • ADAS
  • Aerospace & Defence
  • AI/ML
  • Automation
  • AUTOMOTIVE ELECTRONICS
  • Big Data Analytics
  • Blockchain
  • Cloud Computing
  • Component
  • Connected Cars
  • Data Center
  • Editor's Desk
  • EE-Tech Talk
  • Electronics Components
  • Embedded
  • EVs
  • Future Tech
  • HEVs
  • Industry 4.0
  • Industry News
  • IoT-Internet of Things
  • LED & Lighting
  • LEDs
  • Manufacturing
  • Market Research
  • Medical Electronics
  • Mosfets
  • News
  • Oscilloscopes
  • Policy
  • Power Electronics
  • Product News
  • RENEWABLES
  • RF & Wireless
  • Robotic
  • SDN & NFV
  • Security
  • Semiconductor
  • Sensor
  • Smart Machine
  • SMT/PCB/EMS
  • Sustainability
  • T & M
  • Tech Article
  • Tech Blog
  • TECH ROOM
  • Telecom
  • Uncategorized
  • VR / AR
  • White Papers

Recent News

Naveen Goyal

Meritto Launched Mio AI, the Autonomous Agent Suite Purpose-Built for Education

June 6, 2025
Panasonic

Panasonic Collaboration with MeitY Nasscom CoE to Accelerate Innovation in Smart Residential Living

June 6, 2025
  • About Us
  • Advertise with Us
  • Contact Us

© 2022-23 TechZone Print Media | All Rights Reserved

No Result
View All Result
  • News
    • Industry News
    • Product News
  • TECH ROOM
    • Sensor
    • VR / AR
    • Embedded
    • Medical Electronics
    • Industry 4.0
    • Robotic
    • Automation
    • Smart Machine
    • Component
    • Manufacturing
    • Aerospace & Defence
    • Security
    • Policy
  • Semiconductor
    • AUTOMOTIVE ELECTRONICS
      • EVs
      • HEVs
      • ADAS
      • Connected Cars
    • IoT-Internet of Things
      • Development Kit
      • IoT Design
    • Power Electronics
      • AC-DC/DC-DC Converters
      • Mosfets
      • IGBTs
      • LEDs
  • T & M
    • 5G testing
    • Oscilloscopes
    • SDN & NFV
    • RF & Wireless
  • AI/ML
  • Telecom
    • 5G/6G
  • RENEWABLES
    • Sustainability
  • Future Tech
    • Data Center
    • Cloud Computing
    • Big Data Analytics
  • Webinars
  • Editor’s Pick
    • Tech Article
    • Tech Blog
    • White Papers
    • EE-Tech Talk
    • Market Research
  • EE Awards
    • EE Awards 2025
    • EE Awards 2024
  • MORE
    • E-Mag
    • Events
    • Subscription
    • Contact Us

© 2022-23 TechZone Print Media | All Rights Reserved

Advertisement
Advertisement