Electronics Era

  • About Us
  • Advertise with Us
  • Contact Us
  • e-Mag
  • Webinars
Header logo on website
Advertisement
Advertisement
Menu
  • News
    • Industry News
    • Product News
  • TECH ROOM
    • Sensor
    • VR / AR
    • Embedded
    • Medical Electronics
    • Industry 4.0
    • Robotic
    • Automation
    • Smart Machine
    • Component
    • Manufacturing
    • Aerospace & Defence
    • Security
    • Policy
  • Semiconductor
    • AUTOMOTIVE ELECTRONICS
      • EVs
      • HEVs
      • ADAS
      • Connected Cars
    • IoT-Internet of Things
      • Development Kit
      • IoT Design
    • Power Electronics
      • AC-DC/DC-DC Converters
      • Mosfets
      • IGBTs
      • LEDs
  • T & M
    • 5G testing
    • Oscilloscopes
    • SDN & NFV
    • RF & Wireless
  • AI/ML
  • Telecom
    • 5G/6G
  • RENEWABLES
    • Sustainability
  • Future Tech
    • Data Center
    • Cloud Computing
    • Big Data Analytics
  • Webinars
  • Editor’s Pick
    • Tech Article
    • Tech Blog
    • White Papers
    • EE-Tech Talk
    • Market Research
  • EE Awards
    • EE Awards 2025
    • EE Awards 2024
  • MORE
    • E-Mag
    • Events
    • Subscription
    • Contact Us
Home TECH ROOM Embedded

iWave Unveiled i.MX 91 SoC Powered SoM for Secure and Reliable Linux edge Processing Solutions

Editorial by Editorial
June 7, 2023
in Embedded
Reading Time: 4 mins read
IWAVE
Share on FacebookShare on TwitterShare on LinkedIn

iWave adds to the iW-RainboW-G50M family: The Solderable NXP i.MX 91-based LGA System on Module (SoM). The SoM incorporates the newest member of the i.MX 9 applications processor series and is built on the OSM v1.1 solderable SoM standard, providing extensive interfaces in a rugged and compact form factor.

The Rainbow-G50M family provides for hardware and software commonality and ensures scalability based on the requirement and application. Evaluation Kits of the System on Module will be ready to purchase in June 2023.

The i.MX 91 SoC delivers an optimized blend of security, performance and scalability, and is a perfect foundation block for cost-optimized Linux® edge devices. The i.MX 91 family features an Arm® Cortex®-A55 running at up to 1.4GHz and an integrated EdgeLock® Secure Enclave, together with interfaces such as dual Gigabit Ethernet, dual USB ports, essential I/Os to fit in products used in smart factory, smart home, medical devices, and smart metering.

Key features of OSM System on Module

  • NXP i.MX 91 SoC
  • 2GB LPDDR4 RAM
  • 16GB eMMC Flash
  • 2 x 1Gbps Ethernet Controllers (1 with TSN)
  • 1 x SD(4bit)
  • 1 x USB 2.0 OTG, 4 x USB 4.0 Host
  • Wi-Fi 6 & Bluetooth 5.3 Connectivity
  • IEEE802.15.4 Connectivity
  • Size-L Form Factor: 45mm x 45mm
  • Solderable LGA Package in OSM v1.1 Standard
  • 10+ Years Product Longevity Program

The System on Module is built on a 45mm x 45mm OSM Size-L standard with the provision for 662 contacts, offering the highest pin-to-area ratio across SoM standards. With the ability to directly solder the SoM onto the carrier card, the SoM ensures high levels of robustness and is ideal for products prone to vibrations.

“The i.MX 91 applications processor family from NXP provides an ideal mix of high performance, pricing, and security; fit for entry-level Linux edge processing solutions for applications such as EV Charging Stations, Industrial Gateways, and HMI Displays,” said Immanuel Rathinam, Vice-President of System on Modules Unit at iWave.” The i.MX 9x family of i.MX 91 and i.MX 93 provides customers scalability with reduced development cost and time to market and provides consumers with efficient power management and advanced security features on the edge.

The i.MX 91-based System on Module is integrated on a carrier board, which is positioned as a Single Board Computer and also doubles up as an evaluation kit. The production-ready Single Board Computer is built on a Pico-ITX form factor and integrates the necessary interfaces for applications such as smart home hubs, metering gateways, and industrial automation solutions.

Key features of the Single Board Computer

  • NXP i.MX 91 SoC
  • 2GB LPDDR4 RAM, 16GB eMMC
  • Wi-Fi 6 & Bluetooth 5.3 Connectivity
  • IEEE802.15.4 Connectivity
  • GNSS receiver Module – GPS/GLONASS/Galileo/BeiDou
  • Dual 1000/100/10 Mbps Ethernet
  • USB 2.0 OTG (microAB Receptacle Connector) x 1
  • Dual USB 2.0 Host (TypeA) x 1
  • USB Header x 1 & USB Type-C Connector x 1
  • Micro SD
  • 3.5mm Audio In & Out Jack through I2S Codec
  • M.2 Connector Key B
  • Expansion Connector – UART, CAN, ADC, Tamper, PWM
  • RS232 Header x 1

The System on Module and Single Board Computer are go-to-market and production ready, with all documentation, necessary software drivers, and BSP available for customers. iWave maintains a product longevity program and ensures the availability of the modules for 10+ years.

Tags: i.MX 91-based System on ModuleiW-RainboW-G50MiWaveRainbow-G50MSystem on Module
Editorial

Editorial

Join Our Newsletter

* indicates required
Electronics Era

Electronics Era, India's no.1 growing B2B news forum on Electronics and Cutting Edge Technology is exploring the editorial opportunity for organizations working in the Electronics Manufacturing Services(EMS) Industry.

Follow Us

Browse by Category

  • 5G testing
  • 5G/6G
  • AC-DC/DC-DC Converters
  • ADAS
  • Aerospace & Defence
  • AI/ML
  • Automation
  • AUTOMOTIVE ELECTRONICS
  • Big Data Analytics
  • Blockchain
  • Cloud Computing
  • Component
  • Connected Cars
  • Data Center
  • Editor's Desk
  • EE-Tech Talk
  • Electronics Components
  • Embedded
  • EVs
  • Future Tech
  • HEVs
  • Industry 4.0
  • Industry News
  • IoT-Internet of Things
  • LED & Lighting
  • LEDs
  • Manufacturing
  • Market Research
  • Medical Electronics
  • Mosfets
  • News
  • Oscilloscopes
  • Policy
  • Power Electronics
  • Product News
  • RENEWABLES
  • RF & Wireless
  • Robotic
  • SDN & NFV
  • Security
  • Semiconductor
  • Sensor
  • Smart Machine
  • SMT/PCB/EMS
  • Sustainability
  • T & M
  • Tech Article
  • Tech Blog
  • TECH ROOM
  • Telecom
  • Uncategorized
  • VR / AR
  • White Papers

Recent News

SEMI

EMI Forecast: 69 Percent Growth in Advanced Chipmaking Capacity

June 26, 2025
Raphe mPhibr

Raphe mPhibr Secures USD100M to Expand Aircraft Design and Manufacturing in India

June 26, 2025
  • About Us
  • Advertise with Us
  • Contact Us

© 2022-23 TechZone Print Media | All Rights Reserved

No Result
View All Result
  • News
    • Industry News
    • Product News
  • TECH ROOM
    • Sensor
    • VR / AR
    • Embedded
    • Medical Electronics
    • Industry 4.0
    • Robotic
    • Automation
    • Smart Machine
    • Component
    • Manufacturing
    • Aerospace & Defence
    • Security
    • Policy
  • Semiconductor
    • AUTOMOTIVE ELECTRONICS
      • EVs
      • HEVs
      • ADAS
      • Connected Cars
    • IoT-Internet of Things
      • Development Kit
      • IoT Design
    • Power Electronics
      • AC-DC/DC-DC Converters
      • Mosfets
      • IGBTs
      • LEDs
  • T & M
    • 5G testing
    • Oscilloscopes
    • SDN & NFV
    • RF & Wireless
  • AI/ML
  • Telecom
    • 5G/6G
  • RENEWABLES
    • Sustainability
  • Future Tech
    • Data Center
    • Cloud Computing
    • Big Data Analytics
  • Webinars
  • Editor’s Pick
    • Tech Article
    • Tech Blog
    • White Papers
    • EE-Tech Talk
    • Market Research
  • EE Awards
    • EE Awards 2025
    • EE Awards 2024
  • MORE
    • E-Mag
    • Events
    • Subscription
    • Contact Us

© 2022-23 TechZone Print Media | All Rights Reserved

Advertisement
Advertisement